Pumped Immersion Cooling for High-Power Electronic Subsystems
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The increasing power dissipation in integrated circuit chips poses a cooling challenge, as traditional air-cooling methods become inadequate for high-power modules and large server installations, stressing room air-conditioning systems and requiring more powerful air-moving devices or increased airflow, which is inefficient and noisy.
Innovation Solution
A pumped immersion-cooling apparatus and method that uses a container with coolant inlet and outlet ports, coupled with a coolant pump assembly, to actively circulate coolant through an electronic subsystem, effectively cooling multiple components by direct immersion, thereby reducing the thermal load on air-conditioning systems and allowing for higher performance and reduced noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If air cooling methods are used to cool high power modules, then the cooling system is simple and easy to implement, but the cooling effectiveness is insufficient and the temperature control is inadequate
Solution Approach 1:
The patent applies hydraulic cooling by circulating liquid coolant through channels in the base板和heat exchangers to remove heat from electronic components. This hydraulic approach provides superior temperature control compared to air cooling, while the integrated design keeps the system complexity manageable.
Solution Approach 2:
The patent introduces liquid coolant as an intermediary substance to transfer heat from the electronic components to the heat exchangers. This intermediary medium enables efficient heat transfer and temperature control, resolving the contradiction between cooling effectiveness and system simplicity.
2Productivity
If air flow rate is increased to cool high power modules, then the cooling capacity is improved, but the energy consumption increases and the acoustic noise becomes problematic
Solution Approach 1:
The patent replaces air-based cooling with liquid-based cooling, which has higher heat capacity and thermal conductivity. This hydraulic cooling system achieves superior cooling capacity with lower energy consumption, as liquids can transfer heat more efficiently than gases, reducing the power needed for pumping compared to high-speed fans.
Solution Approach 2:
The patent changes the cooling medium from gas (air) to liquid (coolant), fundamentally altering the thermal transfer parameters. This parameter change enables higher cooling capacity with lower energy input, as liquids have approximately 10 times the heat capacity of air, reducing the volumetric flow rate and associated energy consumption.
3Productivity
If air flow rate is increased to cool high power modules, then the cooling capacity is improved, but the acoustic noise increases
Solution Approach 1:
The patent replaces noisy air-based cooling with quiet liquid-based cooling. Liquid pumps operate at much lower speeds and generate minimal acoustic noise compared to high-velocity air fans, while providing superior cooling capacity through efficient thermal conduction and convection in the liquid medium.
4Loss of energy
If liquid cooling is used for selected components, then the heat transfer efficiency is improved, but the device complexity increases
Solution Approach 1:
The patent merges the cooling function into the baseplate structure itself, which also serves as a mechanical support and electrical connection platform. This integration combines multiple functions into a single component, reducing overall system complexity while maintaining high heat transfer efficiency through direct liquid-to-component contact.
Solution Approach 2:
The baseplate is designed with multi-functionality: it provides structural support, electrical connections, and thermal management. The heat exchangers are integrated into the baseplate, allowing the same structure to serve multiple purposes, thereby reducing system complexity despite the advanced cooling capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides efficient cooling of electronic subsystems, enabling higher performance systems, reducing the load on data center air-conditioning units, and eliminating the need for conventional air-moving devices, thus improving energy efficiency and acoustic performance.
Implementation Method 1
The liquid coolant absorbs the heat dissipated by selected components/modules in an efficient manner
Implementation Method 2
The absorbed heat is ultimately transferred from the liquid to an outside environment
Data Source
AI summary
Apparatus and method are provided for facilitating pumped, immersion-cooling of an electronic subsystem having multiple different types of components to be immersion-cooled. The apparatus includes a container sized to receive the electronic subsystem, and a coolant inlet port and a coolant outlet port for facilitating ingress and egress of coolant through the container. The apparatus further includes a coolant pump assembly coupled in fluid communication with the coolant inlet and outlet ports of the container for facilitating active pumping of coolant through the container. When the electronic subsystem is operatively inserted into the container and coolant is pumped through the container, the multiple different types of components of the electronic subsystem are immersion-cooled by the coolant. In one embodiment, a filler element is disposed within the container, and is sized to reduce the amount of coolant within the container, while still maintaining the components of the electronic subsystem immersion-cooled.