Pumped Immersion Cooling for Electronic Subsystems
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Solution Overview
Problem
The increasing power dissipation in integrated circuit chips poses a cooling challenge, as traditional air-cooling methods become inadequate for high-power modules and large server installations, straining room air-conditioning systems, especially in data centers with multiple server racks.
Innovation Solution
A pumped immersion-cooling apparatus and method that uses a container with coolant inlet and outlet ports, coupled with a coolant pump assembly, to actively circulate coolant through an electronic subsystem, effectively cooling multiple components by direct immersion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If air cooling methods are used to cool high power modules, then cooling capability is improved, but air flow requirements and noise increase
Solution Approach 1:
The patent transitions from air cooling to liquid cooling by introducing a coolant pump assembly and coolant flow paths. The liquid coolant circulates through channels in contact with electronic components, providing efficient heat removal without the noise and high air flow requirements of traditional air cooling systems.
Solution Approach 2:
The patent replaces the mechanical air moving devices (fans, blowers) with a liquid-based cooling system. The coolant pump assembly drives liquid coolant through structured flow paths, eliminating the need for high-speed rotating mechanical components that generate noise.
2Temperature
If more powerful air-moving devices are used to handle increased power dissipation, then cooling effectiveness is improved, but device complexity and energy consumption increase
Solution Approach 1:
The patent employs a liquid coolant circulation system with a pump assembly and structured flow paths instead of complex air-moving devices. The liquid coolant is pumped through channels that directly contact electronic components, providing efficient cooling with simpler mechanical components.
3Loss of energy
If liquid cooling is implemented for selected components, then heat absorption efficiency is improved, but system complexity increases
Solution Approach 1:
The patent divides the cooling system into modular components: a container with integrated coolant flow paths, a coolant pump assembly, and structured coolant circulation channels. This segmentation allows liquid cooling to be implemented for selected high-heat components without cooling the entire system, optimizing heat absorption efficiency while managing complexity.
Solution Approach 2:
The coolant pump assembly serves multiple functions: it circulates coolant through various flow paths, maintains coolant flow rate, and can serve different electronic components with varying heat dissipation requirements. The structured coolant flow paths provide both cooling and structural support.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach provides efficient heat transfer, reducing the load on data center air-conditioning units, enabling higher performance systems, eliminating the need for air-moving devices, and allowing for more compact and functional electronic subsystems with reduced acoustic noise and energy consumption.
Implementation Method 1
The liquid coolant absorbs the heat dissipated by selected components/modules in an efficient manner
Implementation Method 2
The coolant pump assembly is coupled in fluid communication with the coolant inlet port and the coolant outlet port of the container for facilitating active pumping of coolant through the container
Data Source
AI summary
Apparatus and method are provided for facilitating pumped, immersion-cooling of an electronic subsystem having multiple different types of components to be immersion-cooled. The apparatus includes a container sized to receive the electronic subsystem, and a coolant inlet port and a coolant outlet port for facilitating ingress and egress of coolant through the container. The apparatus further includes a coolant pump assembly coupled in fluid communication with the coolant inlet and outlet ports of the container for facilitating active pumping of coolant through the container. When the electronic subsystem is operatively inserted into the container and coolant is pumped through the container, the multiple different types of components of the electronic subsystem are immersion-cooled by the coolant. In one embodiment, a filler element is disposed within the container, and is sized to reduce the amount of coolant within the container, while still maintaining the components of the electronic subsystem immersion-cooled.