Semiconductor Processing Chamber Pumping Liner Cleaning

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Solution Overview

Problem

Conventional in-situ cleaning methods for semiconductor processing chambers are inefficient in cleaning chamber components downstream of the processing volume, leading to prolonged cleaning cycles and reduced production throughput.

Innovation Solution

The implementation of an ex-situ cleaning method using a bypass gas inlet in the pumping liner, combined with a flow control mechanism to regulate the flow of cleaning gases, ensures effective cleaning of the processing volume and downstream components by creating a pressure differential and utilizing choke plates to achieve uniform gas distribution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional in-situ cleaning methods are used, then the processing volume can be cleaned, but downstream chamber components are not effectively cleaned and cleaning cycles are prolonged

Engineering Contradiction:

Improvecleaning effectivenessVSAvoidcleaning cycle duration

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The pumping liner is segmented into multiple zones with different aperture configurations. A first portion has a first set of apertures for cleaning downstream components, while a second portion has a second set of apertures for cleaning the processing volume. This segmentation allows simultaneous cleaning of different chamber regions with optimized gas flow patterns for each zone, effectively resolving the contradiction between comprehensive cleaning and cleaning time.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The pumping liner acts as an intermediary component between the gas distribution system and the chamber components to be cleaned. By introducing a bypass gas inlet that feeds cleaning gas through the pumping liner's apertures, the system mediates the delivery of cleaning gas to both downstream components and the processing volume, enabling effective cleaning without prolonging cycle time.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If cleaning gas is delivered only through the gas distribution member, then upstream components are cleaned, but downstream components remain contaminated

Engineering Contradiction:

Improvecleaning coverageVSAvoidproduction throughput

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The pumping liner is designed with multi-functionality: it serves as both a structural component of the chamber and as a gas distribution mechanism for cleaning downstream components. The bypass gas inlet combined with the apertures in the pumping liner creates a universal cleaning system that addresses both upstream and downstream contamination, thereby improving overall cleaning coverage and maintaining production throughput.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The cleaning gas delivery is extended into a new dimension by utilizing the pumping liner's apertures as an additional gas distribution pathway. This dimensional expansion of the cleaning gas flow path allows cleaning gas to reach downstream components that were previously inaccessible, comprehensive cleaning coverage without sacrificing productivity.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Ease of manufacture

If the pumping liner has uniform apertures, then gas distribution is simple, but uniform cleaning of the entire processing chamber is not achieved

Engineering Contradiction:

Improvepumping liner fabricationVSAvoidcleaning uniformity

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The pumping liner is designed with local quality variations: different portions of the liner have different aperture patterns optimized for their specific cleaning functions. The first portion has apertures configured for downstream component cleaning, while the second portion has apertures for processing volume cleaning. This localized optimization achieves uniform cleaning across the entire chamber while maintaining reasonable manufacturing complexity.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach significantly reduces cleaning time, improves production throughput, and ensures uniform cleaning of the entire processing chamber, including components that were previously difficult to clean with in-situ methods.

Implementation Method 1

The flow control mechanism may be operable to create a pressure differential between a pressure inside a first duct coupling a first gas outlet to an exhaust and a pressure inside a second duct coupling a second gas outlet to the exhaust

Methodology Applied

Scientific EffectPressure differential: Pressure Gradient

Data Source

PatentUS20240247371A1Semiconductor processing chambers and methods for cleaning the same

Publication Date: 2024.07.25 APPLIED MATERIALS INC

AI summary

A processing chamber may include a gas distribution member, a substrate support, and a pumping liner. The gas distribution member and the substrate support may at least in part define a processing volume. The pumping liner may define an internal volume in fluid communication with the processing volume via a plurality of apertures of the pumping liner circumferentially disposed about the processing volume. The processing chamber may further include a flow control mechanism operable to direct fluid flow from the internal volume of the pumping liner into the processing volume via a subset of the plurality of apertures of the pumping liner during fluid distribution into the processing volume from the gas distribution member.