Pumping Liner Flow Control for Faster Semiconductor Chamber Cleaning
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Solution Overview
Problem
Conventional semiconductor processing chamber cleaning methods, particularly in-situ cleaning, are inefficient in cleaning chamber components downstream of the processing volume, leading to prolonged cleaning cycles and reduced production throughput.
Innovation Solution
The implementation of an ex-situ cleaning method using a bypass gas inlet in a pumping liner, combined with a flow control mechanism, allows for concurrent in-situ and ex-situ cleaning, ensuring efficient and uniform cleaning of the entire processing chamber by regulating the flow of cleaning gases through the chamber's internal volumes and apertures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional in-situ cleaning methods are used, then the processing volume is cleaned, but the downstream chamber components are not effectively cleaned and cleaning time is prolonged
Solution Approach 1:
The pumping liner is divided into multiple aperture zones (first plurality and second plurality of apertures) that can be independently controlled. This segmentation allows different regions of the chamber to be cleaned simultaneously through separate gas flow paths, improving both cleaning uniformity and reducing overall cleaning time.
Solution Approach 2:
A bypass gas inlet is introduced as an intermediary component that allows cleaning gas to flow directly into the pumping liner's internal volume. This bypass path enables downstream chamber components to be cleaned concurrently with the processing volume, eliminating the sequential cleaning limitation of conventional methods.
2Productivity
If a bypass gas inlet and flow control mechanism are added, then concurrent in-situ and ex-situ cleaning is enabled, but the device complexity increases
Solution Approach 1:
The pumping liner is designed to serve multiple functions: it acts as both a vacuum pumping interface and a cleaning gas distribution manifold. The existing aperture structure is repurposed to enable dual flow paths (process gas and cleaning gas), avoiding the need for separate cleaning mechanisms and reducing overall system complexity despite added functionality.
Solution Approach 2:
Flow control mechanisms (valves or flow controllers) are implemented to dynamically regulate gas flow distribution between different aperture zones. This dynamic control allows flexible operation modes including concurrent cleaning, sequential cleaning, or process operation, enabling the system to adapt to different production requirements while maintaining high productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces cleaning time, improves production throughput, and ensures uniform cleaning of all chamber components, including those downstream of the processing volume, compared to traditional in-situ methods.
Implementation Method 1
The flow control mechanism may be operable to direct fluid flow into the internal volume via the gas inlet and then into the processing volume via a subset of the plurality of apertures of the pumping liner during fluid distribution into the processing volume from the gas distribution member
Implementation Method 2
The pumping liner may define a plurality of apertures circumferentially disposed about the processing volume and an internal volume that may be in fluid communication with the processing volume via the plurality of apertures
Implementation Method 3
The flow control mechanism may be operable to create a pressure differential between a pressure inside a first duct coupling a first gas outlet to an exhaust and a pressure inside a second duct coupling a second gas outlet to the exhaust
Data Source
AI summary
A processing chamber may include a gas distribution member, a substrate support, and a pumping liner. The gas distribution member and the substrate support may at least in part define a processing volume. The pumping liner may define an internal volume in fluid communication with the processing volume via a plurality of apertures of the pumping liner circumferentially disposed about the processing volume. The processing chamber may further include a flow control mechanism operable to direct fluid flow from the internal volume of the pumping liner into the processing volume via a subset of the plurality of apertures of the pumping liner during fluid distribution into the processing volume from the gas distribution member.