Punched Dielectric Layer Patch Antenna Design
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Solution Overview
Problem
The manufacturing process for patch antennas using high dielectric materials becomes complex and costly, making it difficult to produce small, inexpensive antennas for applications like PDAs and GPS devices, as the thickness of the dielectric layer needs to be precisely adjusted and expensive equipment is required.
Innovation Solution
A patch antenna design featuring a dielectric layer with holes formed by punching, allowing for a low dielectric constant material to be used, which reduces the antenna size and manufacturing complexity, with conductive materials inserted into the holes to connect the patch and ground plate, and optionally using multiple dielectric layers with different thicknesses and relative dielectric constants to enhance radiation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a dielectric material having a high relative dielectric constant is used to reduce the size of the patch antenna, then the antenna size is reduced, but the radiation characteristic is lowered resulting in low gain and manufacturing costs increase
Solution Approach 1:
The patent applies the porous materials principle by forming holes in the dielectric layer. These holes create a porous structure that reduces the effective dielectric constant of the layer, thereby improving radiation characteristics and gain while maintaining a compact antenna size. The holes allow the antenna to achieve better performance without requiring high dielectric constant materials that would increase cost and complexity.
2Volume of moving object
If a dielectric material having a high relative dielectric constant is used to reduce the size of the patch antenna, then the antenna size is reduced, but manufacturing costs increase and yield is rapidly lowered
Solution Approach 1:
By creating a porous dielectric structure with holes, the patent enables the use of standard dielectric materials with lower dielectric constants. This approach simplifies the manufacturing process, avoids the need for expensive high dielectric constant materials, and improves yield while maintaining small antenna dimensions.
3Manufacturing precision
If the dielectric layer thickness is precisely adjusted to achieve desired antenna performance, then antenna performance is optimized, but the manufacturing process becomes complex and requires expensive equipment
Solution Approach 1:
The patent forms holes in the dielectric layer using a punching process, which is a simple and cost-effective manufacturing technique. This approach avoids the need for precise dielectric layer thickness adjustment and expensive manufacturing equipment, while still achieving the desired antenna performance through the porous structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process, reduces costs, and allows for the production of small, high-gain patch antennas with desired resonance frequencies, achieving similar performance to antennas using high dielectric materials while maintaining a lower size and manufacturing cost.
Implementation Method 1
a dielectric layer 90 that has one or more holes 92, 94 formed by punching and is provided between the patch 70 and the ground plate 80
Data Source
AI summary
The present invention provides a patch antenna having a dielectric layer that is composed of one dielectric film, has one or more holes formed therein by punching, and is provided between a patch and a ground plate, and a method of manufacturing the patch antenna. Since the patch antenna uses a dielectric material having a low relative dielectric constant (a low dielectric material), it is possible to reduce the size of a patch antenna and improve productivity.