Pure Water Supply Line Cleaning With Micro-Nano Bubbles
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Solution Overview
Problem
The number of particles detected on silicon wafer surfaces suddenly increases when cleaning is performed repeatedly using a single-wafer processing wafer cleaning apparatus, due to particles accumulating inside the pure water supply line and being redeposited onto the wafers during the rinsing step.
Innovation Solution
Introducing micro-nano bubble-containing water into the pure water supply line to clean the pipe, using a three-way valve to direct the bubbles away from the wafer surfaces and into the waste liquid line, and performing the pipe cleaning step concurrently with the wafer drying step to prevent particle redeposition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If repeated wafer cleaning is performed using a single-wafer processing cleaning apparatus, then cleaning capacity is maintained, but particles accumulate in the pure water supply line and are redeposited onto wafer surfaces
Solution Approach 1:
The system performs preliminary cleaning action by introducing pure water containing micro-nano bubbles into the pure water supply line before normal wafer cleaning operations. This preliminary action removes accumulated particles from the supply line, preventing their subsequent redeposition onto wafer surfaces during repeated cleaning cycles
Solution Approach 2:
The system changes the physical state of pure water by generating micro-nano bubbles within it. This parameter change (from ordinary water to bubble-containing water) enhances the cleaning effect on particles accumulated in the supply line, allowing effective particle removal without affecting normal cleaning operations
2Manufacturing precision
If pure water is continuously supplied to rinse wafers, then cleaning quality is maintained, but particles in the supply line are redistributed and deposited on wafer surfaces
Solution Approach 1:
The system converts the harmful effect of particle accumulation in the supply line into a beneficial cleaning mechanism. By introducing micro-nano bubbles into the pure water supply line, the system uses the bubble dynamics to dislodge and remove particles that would otherwise be harmful, transforming the problem of particle accumulation into an effective cleaning solution
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively prevents a sudden increase in particles on wafer surfaces by efficiently removing accumulated particles from the pipe, ensuring consistent cleaning quality throughout repeated wafer processing.
Implementation Method 1
introducing pure water containing micro-nano bubbles into the pure water supply line to clean the pipe
Data Source
AI summary
Provided is a method of preventing a sudden increase in the number of particles detected on wafer surfaces even when cleaning of a wafer is performed repeatedly using a single-wafer processing wafer cleaning apparatus. The method uses a single-wafer processing wafer cleaning apparatus including a rotatable stage; chemical solution supply nozzles; pure water supply nozzles; a chemical solution supply line for supplying chemical solutions to the chemical solution supply nozzles; a pure water supply line for supplying pure water to the pure water supply nozzles; and a waste liquid line. The method includes a pipe cleaning step of introducing pure water containing micro-nano bubbles into the pure water supply line, and cleaning the pipe of the pure water supply line.