Gas Purge Nozzle Timing for Semiconductor Container Stability
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Solution Overview
Problem
The existing gas purge methods for semiconductor manufacturing processes often result in container leaning, which damages wafers, leads to gas leaks, and allows outside gases to enter, due to insufficient contact between purge nozzles and ports, compromising handling performance and cleanliness.
Innovation Solution
A gas purge apparatus with a movement regulating mechanism and two purge nozzles of different elevated positions, where the first nozzle contacts the first purge port before the second, minimizing the moment causing container leaning and ensuring airtight connections to prevent leaks and maintain cleanliness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single purge nozzle contacts the purge port at the bottom of the container, then the gas purging function is achieved, but the container leans due to the moment generated by the contact force
Solution Approach 1:
The single purge nozzle is divided into multiple purge nozzles (first purge nozzle and second purge nozzle) positioned at different locations on the bottom of the container. This segmentation distributes the contact forces across multiple points, preventing the generation of a significant moment that would cause container leaning, while still achieving effective gas purging through multiple purge ports.
Solution Approach 2:
Multiple purge nozzles are combined to work simultaneously on different purge ports at the bottom of the container. By coordinating the contact of multiple nozzles with multiple ports, the system achieves both the gas purging function and container stability, as the distributed contact forces balance each other and prevent leaning.
2Productivity
If the purge nozzle is moved close to the purge port to ensure contact, then gas purging effectiveness is improved, but the container may lean due to the moment caused by the contact force
Solution Approach 1:
The gas purging function is segmented across multiple nozzle-port contact points distributed at the bottom of the container. This allows each individual contact to be optimized for effectiveness while the overall distribution prevents the generation of destabilizing moments, resolving the contradiction between purging effectiveness and container stability.
3Reliability
If the container leans during purging, then the purge nozzle can contact the purge port, but handling performance of wafers deteriorates and gas leaks occur
Solution Approach 1:
By segmenting the purging operation into multiple distributed nozzle-port contacts at the container bottom, the system achieves reliable sealing and contact without causing container leaning. This maintains proper container orientation, ensuring both reliable gas purging and optimal wafer handling performance.
Solution Approach 2:
The multiple distributed purge nozzles are positioned and controlled to prevent the container from leaning in the first place, rather than correcting leaning after it occurs. This preliminary anti-action approach maintains container stability throughout the purging process, ensuring both reliable contact and proper wafer handling conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents container leaning during gas purging, maintains wafer handling performance, ensures sufficient contact between nozzles and ports, and prevents outside gas entry, allowing for effective and efficient cleaning of the container.
Implementation Method 1
a first purge nozzle configured to airtightly connect to the first purge port... a second purge nozzle configured to airtightly connect to the second purge port... introducing a cleaning gas into a container
Implementation Method 2
a movement regulating mechanism configured to contact with the container at a predetermined regulating position and regulate a relative movement at least in an upward direction of the container to the table
Implementation Method 3
a first nozzle driving mechanism configured to move the first purge nozzle between a first lowered position spaced from the first purge port and the first elevated position... a second nozzle driving mechanism configured to move the second purge nozzle between a second lowered position spaced from the second purge port and the second elevated position
Data Source
AI summary
A gas purge apparatus, a load port apparatus, and a gas purge method are capable of filling a container with a cleaning gas without leaning the container to be purged. The first and second purge nozzles are configured to be escalated so that the first purge nozzle 30-1 contacts with the first purge port 5-1 whose distance to the regulating distance 90 is near before the second purge nozzle 30-2 contacts with the second purge port 5-2.