Purge Ring Groove Design for Semiconductor Chamber Residue Management
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Solution Overview
Problem
In semiconductor manufacturing, residue deposits in processing chambers due to radicals from process gases lead to increased cleaning frequency, reduced component lifespan, and throttle valve drift, affecting process uniformity and efficiency.
Innovation Solution
A purge ring with arcuate and radial grooves is affixed to the bottom plate of the processing chamber, directing purge gas to lower regions to prevent and remove residue deposits, thereby reducing cleaning needs and extending component lifespan, and improving flow conductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If process gases are used for material deposition, then material layers are formed on substrates, but residue deposits accumulate on chamber components
Solution Approach 1:
Purge gas is introduced through the purge ring during the deposition process to preemptively prevent residue accumulation on the bottom plate and chamber components, rather than cleaning after residue forms
Solution Approach 2:
A purge gas flow is introduced as an intermediary substance between the process gas and the chamber components, creating a protective gas barrier that prevents residue-forming radicals from contacting and depositing on surfaces
2Reliability
If cleaning operations are performed frequently to remove residue, then component reliability is maintained, but productivity decreases
Solution Approach 1:
The purge gas system performs preliminary protection during deposition, preventing residue accumulation that would otherwise require frequent cleaning interruptions and reducing downtime between production cycles
Solution Approach 2:
The purge gas flows continuously or periodically during deposition operations, maintaining continuous protection against residue formation without interrupting the manufacturing process for cleaning operations
3Object-generated harmful factors
If purge gas is directed to lower chamber regions, then residue accumulation is reduced, but device complexity increases
Solution Approach 1:
The purge gas delivery system is segmented into multiple independent fluid ports distributed around the chamber periphery, allowing localized purge gas introduction at different positions to effectively cover lower chamber regions
Solution Approach 2:
The purge ring structure extends the gas distribution into the vertical dimension by introducing purge gas at the chamber bottom level, creating a three-dimensional gas flow pattern that reaches lower regions not accessible by conventional horizontal gas distribution
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The purge ring effectively reduces residue accumulation, decreases contamination, and minimizes throttle valve drift, enhancing the operational efficiency and longevity of chamber components.
Implementation Method 1
The second surface may define one or more arcuate grooves, each of the arcuate grooves extending into a respective one of the at least one fluid port. The one or more arcuate grooves may be generally parallel with the inner edge and the outer edge of the ring body. The second surface may define a plurality of radial grooves that each extend from the open interior to one of the one or more arcuate grooves.
Data Source
AI summary
Exemplary processing chambers may include a body having sidewalls and a bottom plate. The bottom plate may define an exhaust opening and a gas inlet. The chambers may include a faceplate seated atop the body. The chambers may include a purge ring seated atop the bottom plate. The purge ring may include a ring body having an outer edge and an inner edge defining an open interior. The ring body may have a surface disposed against the bottom plate. The ring body may define an opening aligned with the exhaust opening. The surface may define a fluid port aligned and coupled with the gas inlet. The surface may define arcuate grooves extending into the fluid port. The arcuate grooves may be parallel with the inner and outer edges. The surface may define radial grooves extending from the open interior to an arcuate groove.