Push Pin Module for LED Chip Transfer
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Solution Overview
Problem
Conventional pick-up and place transfer methods struggle to securely transfer ultra small-sized light emitting diode (LED) chips due to insufficient vacuum pressure and air pressure when the chip size is reduced to several micrometers, making it difficult to handle these tiny chips effectively.
Innovation Solution
A transfer apparatus and method that uses a push pin module to transfer LED chips by pushing them from the opposite surface of a first substrate onto a second substrate, with a pressure control unit maintaining a predetermined pressure between the chip and the substrate, allowing for precise and efficient transfer of individual or multiple chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the chip size is reduced to several micrometers to achieve ultra small-sized LED chips, then the application field requiring low power and small size is expanded, but it becomes impossible to secure sufficient vacuum pressure and air pressure due to channel resistance of the collet hole
Solution Approach 1:
The patent replaces the conventional vacuum-based collet holding system with a push pin-based mechanical pushing system. Instead of using vacuum pressure through collet holes to hold and transfer chips, the invention uses push pins to mechanically push the chips from the rear surface, eliminating the dependency on vacuum pressure that becomes insufficient at micrometer-scale chip sizes.
Solution Approach 2:
The patent inverts the conventional transfer approach by pushing the chip from the opposite direction (rear surface) rather than holding it from the front surface. This inversion allows the use of push pins to apply force directly to the chip's rear surface, enabling reliable transfer of ultra-small chips without being constrained by the channel resistance issues of front-surface collet holes.
2Device complexity
If the conventional pick-up and place method is used for transferring ultra small-sized LED chips, then the existing transfer apparatus structure is maintained, but it is difficult to transfer the chips due to insufficient vacuum and air pressure
Solution Approach 1:
The patent replaces the vacuum-based mechanical system with a direct mechanical pushing system. The push pin module provides straightforward mechanical contact and force application to the chip's rear surface, simplifying the transfer mechanism and improving ease of operation for ultra-small chips without requiring complex vacuum pressure control.
Solution Approach 2:
The push pin acts as an intermediary element between the transfer apparatus and the ultra-small LED chip. This intermediary component enables reliable force transmission to the chip's rear surface, facilitating easy and accurate transfer of micrometer-scale chips that cannot be effectively handled by conventional vacuum-based methods.
3Productivity
If multiple push pin units are used to transfer multiple LED chips simultaneously, then productivity is improved, but the pressure control complexity increases
Solution Approach 1:
The patent merges the pressure control functions of multiple push pin units into a single integrated pressure control unit. This unified control system manages the pressure for all push pins simultaneously, enabling the transfer of multiple chips in parallel while avoiding the complexity of individual pressure control for each push pin, thus maintaining high productivity with manageable system complexity.
Solution Approach 2:
The pressure control unit is designed with multi-functionality to serve all push pin units simultaneously. This universal pressure control mechanism can regulate and maintain pressure for multiple chips being transferred at the same time, improving productivity while keeping the control system relatively simple through its ability to handle multiple functions with a single unit.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables high positional accuracy and improved productivity in transferring ultra small-sized LED chips, ensuring they are transferred at a uniform height and preventing damage, while allowing for simultaneous transfer of multiple chips using multiple push pin units.
Implementation Method 1
a pressure control unit for maintaining a pressure between the light emitting diode chip and the second substrate to be a predetermined pressure
Data Source
AI summary
A transfer apparatus for transferring a plurality of light emitting diode chips, comprising a stage on which a first substrate having the plurality of light emitting diode chips mounted on one surface is placed, a work table on which a second substrate to which the plurality of light emitting diode chips are to be transferred is placed, and a push pin module for transferring the plurality of light emitting diode chips to the second substrate by pushing the other surface of the first substrate in a state that one surface of the first substrate and the second substrate are disposed to face each other, wherein the push pin module includes a plurality of push pin units each including a push pin for pushing the other surface of the first substrate, and the push pin module transfers the plurality of light emitting diode chips corresponding to each push pin of the plurality of push pin units to the second substrate at a time.