Push Plate With Protrusions For Uniform Semiconductor Chip Bonding
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Solution Overview
Problem
The challenge lies in efficiently mounting and bonding small semiconductor chips on smaller semiconductor packages, as existing methods face difficulties in applying uniform pressure and ensuring proper bonding, especially with uneven surfaces and corner areas, which can lead to cracking and contamination.
Innovation Solution
An apparatus with a push member featuring a push plate and push rod, where the push plate has a central portion smaller than the chip area and protrusions at its ends, applies pressure uniformly across the chip, including its corners, using a pressure gauge to adjust and maintain the pressure, ensuring even bonding and minimizing overflow of the joining member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional push plate is used to apply pressure to small semiconductor chips, then the bonding process can be performed, but the pressure distribution becomes uneven leading to cracking and contamination
Solution Approach 1:
The push plate incorporates protrusions at its four corners that correspond to the corner regions of the semiconductor chip. These protrusions concentrate pressure locally at the corners, ensuring uniform pressure distribution across the entire chip surface including the previously problematic corner areas, thereby preventing cracking and contamination while maintaining bonding uniformity
2Productivity
If pressure is applied to small semiconductor chips during stacking, then bonding is achieved, but corner areas experience uneven pressure causing cracking
Solution Approach 1:
The push plate design with corner protrusions addresses the specific vulnerability of corner areas by delivering concentrated local pressure exactly where needed. This ensures that during the stacking process, all regions of the small semiconductor chip receive appropriate pressure, maintaining chip integrity while enabling efficient bonding and stacking operations
3Force
If a push plate with area smaller than chip area is used, then pressure can be applied, but corner areas may not receive sufficient pressure
Solution Approach 1:
The push plate is designed with a central portion having area smaller than the chip area, combined with four protrusions at the corners. This configuration enables the push plate to apply pressure effectively: the central portion covers the main chip area while the protrusions extend to deliver concentrated pressure to the corner regions, achieving uniform pressure distribution across the entire chip surface
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient and uniform bonding of semiconductor chips on substrates, preventing cracking and contamination by ensuring even pressure distribution, thereby enhancing the reliability and manufacturing efficiency of semiconductor packages.
Implementation Method 1
a push member configured to apply pressure to a semiconductor chip disposed on a substrate
Implementation Method 2
The push member includes a push plate configured to contact the semiconductor chip, and a push rod connected to the push plate
Data Source
AI summary
An apparatus for stacking semiconductor chips includes a push member configured to apply pressure to a semiconductor chip disposed on a substrate. The push member includes a push plate configured to contact the semiconductor chip, and a push rod connected to the push plate. The push plate includes a central portion having an area smaller than an area of an upper side of the semiconductor chip, and a plurality of protrusions disposed at respective ends of the central portion.