Push-Up Block Layout for Low-Damage Die Peeling
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Solution Overview
Problem
Semiconductor dies are often damaged during the peeling process from dicing tape due to existing push-up unit mechanisms, which fail to effectively minimize damage during the peeling and picking-up operations.
Innovation Solution
A semiconductor manufacturing device with a push-up unit featuring a block unit design, where an outside block with a longer first-direction length and multiple inside blocks with openings are used to gently lift the dicing tape, reducing the stress and damage to the dies by controlling the peeling sequence and tension.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a conventional push-up unit with simple blocks is used to peel dies from dicing tape, then the peeling process is simple and fast, but the dies are damaged due to excessive stress and improper tension control
Solution Approach 1:
The push-up unit is divided into multiple blocks (first block, second block, third block) with different functions. The first block peels the dicing tape from the periphery, the second block pushes up the peeled portion, and the third block supports the die. This segmentation allows each block to perform a specific function, reducing unnecessary stress on the die while maintaining efficient peeling speed.
Solution Approach 2:
Each block has locally optimized properties: the first block has a peeling surface for initiating peel, the second block has a pushing-up surface for lifting the tape, and the third block has a support surface for stabilizing the die. These localized functional surfaces ensure that stress is applied only where needed, minimizing die damage while maintaining productivity.
2Object-affected harmful factors
If multiple blocks are used to control the peeling sequence, then die damage is reduced through better tension control, but the device complexity increases
Solution Approach 1:
Multiple functional blocks are merged into a single integrated block unit that moves as one assembly. The first, second, and third blocks are positioned relative to each other within the same unit and are driven simultaneously, combining multiple functions into a single structural entity. This reduces the complexity of coordinating separate mechanisms while maintaining the benefits of staged peeling.
Solution Approach 2:
The block unit serves multiple functions simultaneously: it initiates peeling, pushes up the dicing tape, and supports the die all in one operational cycle. This multi-functionality eliminates the need for separate mechanisms for each step, reducing overall device complexity while achieving gentle, controlled peeling that minimizes die damage.
Data Source
AI summary
A semiconductor manufacturing device includes: a wafer holder for holding a dicing tape to which a die is attached; and a push-up unit having a block unit for pushing up the dicing tape. The block unit includes: an outside block having a first-direction length longer than a second-direction length in a planar view and having a plurality of openings; and an inside block placed inside the openings. The inside blocks are plural and are placed side by side along the first direction.