Back Side Connection Layer for PV Module with Integrated Bypass Diodes
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Solution Overview
Problem
Existing photovoltaic module designs with back-side connections require additional wiring and circuitry for by-pass diodes, increasing module size and complexity, and are not aesthetically pleasing, while also facing challenges with current carrying capacity and power dissipation under shading conditions.
Innovation Solution
A back side connection layer with by-pass diode functionality is integrated into the photovoltaic module, allowing external electrical connections to the first and last PV-cell of each string within a two-by-two arrangement, eliminating the need for additional wiring or circuitry and optimizing the surface area usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If additional wiring and circuitry are added for by-pass diodes in back-side connection designs, then by-pass diode functionality is achieved, but module size increases and aesthetics deteriorate
Solution Approach 1:
The patent merges the by-pass diode circuitry with the back-side connection layer by integrating conductive traces directly into the connection layer structure. This allows the by-pass diodes to be formed using the same manufacturing process and materials as the main cell connections, eliminating the need for separate wiring and circuitry components.
Solution Approach 2:
The back-side connection layer serves multiple functions simultaneously: it provides electrical connections for the photovoltaic cells, implements by-pass diode functionality through integrated conductive traces, and maintains aesthetic appearance by keeping all connections on the back side without external wiring. This multi-functional design resolves the contradiction between achieving by-pass functionality and maintaining compact module size.
2Reliability
If additional wiring and circuitry are added for by-pass diodes, then by-pass diode functionality is achieved, but device complexity increases
Solution Approach 1:
The patent combines multiple functions into a single integrated structure. The back-side connection layer incorporates both the main cell interconnections and the by-pass diode circuitry using the same conductive traces and manufacturing process, reducing the number of separate components and handling steps required.
Solution Approach 2:
The manufacturing process is designed to automatically form both the cell connections and by-pass diode traces in a single deposition step. The conductive material is patterned to self-organize into the required circuit topology, eliminating the need for additional wiring assembly steps and reducing manufacturing complexity.
3Reliability
If cross connectors are placed outside cell areas to connect cells to junction box, then electrical connections are established, but module size increases and aesthetics are compromised
Solution Approach 1:
The patent moves all electrical connections from the front/dimensions to the back side of the module, utilizing the back surface as a dedicated connection plane. This dimensional reorganization allows all wiring and connectors to be concealed on the back, maintaining a clean front appearance while establishing reliable electrical connections through the integrated back-side connection layer.
Data Source
Figure 1~2a
Figure 2b~3
Figure 4~5
AI summary
Back side connection layer for a photo-voltaic module comprising a plurality of PV- cells (i,j), the plurality PV-cells (i,j) being of a type having one or more back side contacts and divided in a preset number of strings (3) of series connected PV-cells (i. j). By-pass diodes are connectable in parallel to each of the preset number of strings (3), and three or more strings (3) are provided. The plurality of PV-cells (i,j) are positioned such that electrical connections to the first PV-cell and last PV-cell of each of the preset number of strings (3) are provided in a part of the back side connection layer overlapping a part of a two-by-two arrangement of PV-cells (i,j).