Photovoltaic Module Bonding Strip Layout for Reliable Ribbon Soldering
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Solution Overview
Problem
Insecure soldering and poor soldering occur between ribbons and pads in photovoltaic modules due to varying pad sizes, affecting reliability and photoelectric conversion efficiency.
Innovation Solution
A photovoltaic module design with strip-shaped bonding layers and electrical connectors arranged to intersect with these strips, reducing the height of the bonding layers and increasing contact area, ensuring reliable connections and improved soldering yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If tin layers are arranged between pads to improve connection reliability, then soldering reliability improves, but soldering quality deteriorates due to varying pad sizes causing insecure soldering
Solution Approach 1:
The patent applies local quality by making different pads have different areas matched to their specific connection needs. Large pads are used for main electrical connectors requiring high current capacity, while small pads are used for secondary connections. This localized differentiation ensures each pad provides optimal soldering quality for its specific function, resolving the contradiction between overall reliability and uniform soldering quality.
2Strength
If bonding layer height is increased to improve connection strength, then connection reliability improves, but connector positioning accuracy deteriorates due to connector offset
Solution Approach 1:
The patent resolves this contradiction by transitioning from a single-layer bonding structure to a multi-layer bonding structure. The bonding layers are arranged in different spatial dimensions (stacked vertically), providing both mechanical support and precise positioning. This dimensional change allows the bonding layers to offer strength through their layered configuration while maintaining positioning accuracy through the structured arrangement that guides connector placement.
3Ease of manufacture
If pad areas are made uniform to simplify manufacturing, then manufacturing complexity reduces, but connection reliability deteriorates due to insecure soldering on large pads
Solution Approach 1:
The patent implements local quality by designing pads with different areas according to their specific functional requirements. Large pads provide adequate soldering surface area for main connectors, while small pads are sufficient for secondary connections. This localized optimization maintains manufacturing feasibility while ensuring each pad achieves reliable soldering for its intended purpose, avoiding the need for uniform pad sizes.
Data Source
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AI summary
The present application discloses a photovoltaic module, manufacturing methods thereof, and screen printing stencils, and relates to the field of photovoltaic technologies. The photovoltaic module includes a solar cell body, a connection portion, a first bonding layer, and an electrical connector. The solar cell body includes a first surface and a second surface arranged opposite to each other. The connection portion is arranged on the first surface. The connection portion includes a first connection portion and a second connection portion. The first connection portion and the second connection portion are arranged at intervals along a first direction. An area of the first connection portion is larger than an area of the second connection portion. The first bonding layer is arranged on a surface of the first connection portion away from the solar cell body. The first bonding layer includes at least two first bonding strips having a strip-shaped structure. The at least two first bonding strips extend along a second direction and are arranged at an interval along the first direction. The electrical connector is arranged on the first bonding layer. The electrical connector extends along the first direction and intersects with the at least two first bonding strips having the strip-shaped structure. The electrical connector is electrically connected to the first connection portion through the first bonding layer.