Photovoltaic Module Bypass Diode Integration

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Solution Overview

Problem

Conventional photovoltaic module assembly techniques require numerous components and complex processes, leading to high production costs, material expenditure, and susceptibility to faults due to the use of prepreg technology and multiple operating steps.

Innovation Solution

A photovoltaic module design featuring a series connection of solar cells and bypass diodes on an electrically insulating substrate with a conductive carrier, where the bypass diode assumes both protective and insulating functions, reducing the number of components and assembly steps while enabling effective heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional prepreg technology and multiple components are used for series connection of solar cells, then reliable electrical connection and protection are achieved, but production costs, material expenditure, and assembly complexity increase significantly

Engineering Contradiction:
Improveprotection of solar cellsVSAvoidnumber of components and assembly steps
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the bypass diode and insulating layer into a single integrated component. The bypass diode is applied directly on the rear side of the solar cell, eliminating the need for separate insulating layers and reducing the number of components. This merging reduces assembly steps and production costs while maintaining the protective function.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The bypass diode serves multiple functions simultaneously: it provides electrical protection for the solar cell, acts as an insulating element, and enables series connection of multiple solar cells. This multi-functionality reduces the overall component count and simplifies the module structure.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If multiple individual parts and assembly steps are used for series connection, then functional requirements are met, but production time increases and throughput decreases

Engineering Contradiction:
Improveelectrical connection qualityVSAvoidproduction throughput
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The bypass diode is pre-applied on the rear side of the solar cell during cell manufacturing, before module assembly. This preliminary action eliminates the need for separate application steps during module production, reducing cycle times and increasing throughput while ensuring proper electrical connection.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

By merging the bypass diode application with the solar cell manufacturing process, the patent eliminates multiple separate assembly steps. This integration reduces production time and increases throughput while maintaining connection quality.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If conventional series connection methods are used, then solar cells are protected from voltage in stop band, but the number of components and storage logistics complexity increase

Engineering Contradiction:
Improveprotection from voltage damageVSAvoidnumber of components
Core Design Contradiction:
ReliabilityVSQuantity of substance

Solution Approach 1:

The bypass diode is designed to perform multiple functions: protecting the solar cell from voltage damage, providing electrical connection, and serving as an insulating element. This multi-functionality reduces the total number of components needed while maintaining protection capabilities.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent merges the bypass diode with the solar cell structure by applying it directly on the rear side. This integration eliminates the need for separate protective components and reduces inventory complexity for storage and logistics.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design simplifies the assembly process, reduces material usage and costs, enhances reliability, and minimizes the risk of faults by integrating multiple functions into a single component, allowing for efficient production and operation in high-concentrator systems.

Implementation Method 1

an insulating layer must be present, said insulating layer being produced by a diode in the case of the invention. In the photovoltaic module, this diode serves at the same time as protective or bypass diode.

Methodology Applied
Scientific EffectDiode: Diode

Implementation Method 2

the solar cell and the bypass diode are applied on the conductive carrier via a conductive connecting layer

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 3

at least two component cell groups (SCA) which are connected to each other and disposed on an electrically insulating basic body

Methodology Applied
Scientific EffectElectrical insulation: Dielectric

Data Source

PatentUS7977567B2Photovoltaic module and the use thereof
Publication Date: 2011.07.12 FRAUNHOFER GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG EV
  • US7977567B2 patent drawing
  • US7977567B2 patent drawing
  • US7977567B2 patent drawing

AI summary

The present invention relates to a photovoltaic module, comprising at least two component cell groups (SCA) which are connected to each other and disposed on an electrically insulating basic body, which groups comprise respectively one solar cell which is applied on a thermally and electrically conductive carrier and a bypass diode which is applied at a spacing thereto, and which are contacted with each other via an electrical conductor, the bypass diode having a polarity which is inverse to the solar cell and the solar cell and the bypass diode being applied on the conductive carrier via a conductive connecting layer.