Photovoltaic Connection Device Thermal Management via Segmented Base Body
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Solution Overview
Problem
Existing photovoltaic connection devices lack effective cooling mechanisms, which can lead to thermal issues and reduced reliability in photovoltaic systems, especially when bypass diodes generate heat.
Innovation Solution
A connecting device with a thermally conductive base body and electrically insulating housing, featuring a contact surface section in direct thermal contact with the photovoltaic module's frame, allowing for efficient heat dissipation through a thermally conductive and electrically insulating substrate with conductor tracks for diodes, and mechanical connections for secure mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the circuit arrangement is arranged directly on the solar cells using flat conductors, then the electrical connection is simple and direct, but the heat generated in the circuit arrangement cannot be effectively dissipated
Solution Approach 1:
The connection device is divided into functionally independent components: a thermally conductive base body for heat dissipation, an electrically insulating housing for electrical isolation, and a circuit arrangement module. This segmentation allows each component to optimize its specific function - the base body dissipates heat while the housing provides electrical insulation, resolving the contradiction between simple electrical connection and effective heat dissipation.
Solution Approach 2:
The thermally conductive base body acts as an intermediary between the circuit arrangement and the frame of the photovoltaic module. It provides a dedicated thermal pathway for heat generated in the circuit arrangement to be conducted to the frame, while the electrically insulating housing serves as an intermediary to prevent electrical contact between the circuit arrangement and the frame, simultaneously addressing both thermal and electrical requirements.
2Temperature
If a thermally conductive base body is used to dissipate heat from the circuit arrangement, then heat dissipation is improved, but electrical insulation between the circuit arrangement and frame must be ensured
Solution Approach 1:
The patent merges multiple functions into integrated components: the base body combines thermal conduction functionality with structural support, while the housing combines electrical insulation with mechanical protection. The circuit arrangement is integrated onto the base body, creating a unified assembly that reduces overall system complexity despite adding thermal management capabilities.
Solution Approach 2:
The thermally conductive base body serves multiple functions: it provides a mounting surface for the circuit arrangement, acts as a heat sink for thermal management, and provides structural support for the entire connection device. The housing similarly provides both electrical insulation and mechanical protection, reducing the need for separate components and thereby managing device complexity.
3Temperature
If the contact surface section is in direct thermal contact with the frame, then heat dissipation efficiency is maximized, but mechanical connection and electrical insulation must also be maintained
Solution Approach 1:
The connection device applies local quality differentiation: the base body makes direct thermal contact with the frame at specific contact points to maximize heat dissipation efficiency, while the housing provides electrical insulation at critical interfaces. This localized approach to thermal and electrical management allows optimal heat dissipation without compromising mechanical connection or electrical insulation requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances cooling efficiency within the connection device, improving the reliability and performance of photovoltaic systems by effectively dissipating heat generated by the circuit arrangement, thereby maintaining system integrity and efficiency.
Implementation Method 1
a thermally conductive base body... The circuit arrangement is connected to the button section of the base body in a thermally conductive and electrically insulating manner, with the heat generated in the circuit arrangement being able to be dissipated via the base body
Implementation Method 2
The contact surface section is used for thermal contact with the above-mentioned frame of a photovoltaic module... the heat generated in the circuit arrangement being able to be dissipated via the base body and the contact surface section to the frame of the photovoltaic module
Implementation Method 3
an electrically insulating housing, which frees the contact surface section
Data Source
Figure 1~2
Figure 3
Figure 4~5
AI summary
The connecting assembly (2) has a thermally conductive portion (20) whose contact surface portion is thermally contacted to a button portion for arranging a circuit device (3). An electrically insulating housing has two connecting elements (50,52) for saving the contact surface portion. Connecting element (50) makes circuit device to perform electrical connection with solar cells of photovoltaic module (6). Connecting element (52) makes circuit device to perform electrical connection with components (1,8) of photovoltaic system (100).