Photovoltaic Cell Electrode Masking for Edge Short-Circuit Prevention
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Solution Overview
Problem
In photovoltaic cell manufacturing, low-temperature processes for forming electrodes are challenging due to edge short circuits caused by copper electroplating, which require post-etching and increase costs and damage to the cell surface, affecting efficiency and yield.
Innovation Solution
A method involving a mask material layer deposited over the photovoltaic device's side and surface, with local openings created using ultraviolet light or laser exposure, followed by electrochemical deposition of metal, and subsequent removal of the mask material to form an electrode, preventing edge short circuits and reducing manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If electroplating is used to deposit copper on the photovoltaic cell surface, then manufacturing efficiency is improved, but edge short circuits occur causing increased manufacturing cost and surface damage
Solution Approach 1:
The patent applies preliminary action by depositing a mask material layer on the side surface of the photovoltaic cell before the electroplating process. This mask layer prevents copper ions from reaching the side surface during electroplating, thereby avoiding edge short circuits while allowing efficient copper deposition on the front and back surfaces. The mask layer is removed after electroplating completes its protective function.
Solution Approach 2:
The mask material layer serves as an intermediary substance between the copper ions and the side surface of the photovoltaic cell. It temporarily blocks the harmful interaction (copper deposition on side surface causing short circuit) while permitting the useful interaction (copper electrode formation on front and back surfaces) to proceed efficiently.
2Object-affected harmful factors
If post-etching is used to remove deposited copper from the side surface, then edge short circuits are prevented, but manufacturing cost increases and surface damage occurs
Solution Approach 1:
Instead of performing post-etching to remove copper from the side surface, the patent applies preliminary action by depositing a mask material layer on the side surface before electroplating. This prevents copper deposition on the side surface in the first place, eliminating the need for costly and damaging post-etching processes while still preventing edge short circuits.
Solution Approach 2:
The patent converts the potentially harmful effect of electroplating (copper deposition on side surface causing short circuits) into a beneficial process by using the mask material layer. The electroplating process itself becomes beneficial for forming electrodes on the front and back surfaces without the harmful side effect, eliminating the need for additional corrective etching steps.
3Object-affected harmful factors
If post-etching is used to remove deposited copper from the side surface, then edge short circuits are prevented, but cell surface is damaged affecting efficiency and yield
Solution Approach 1:
The patent applies preliminary action by depositing a mask material layer on the side surface before electroplating. This prevents copper ions from depositing on the side surface during electroplating, thereby preventing edge short circuits without requiring subsequent etching that would damage the cell surface. The mask layer is removed after electroplating, leaving the cell surface intact.
Solution Approach 2:
The mask material layer acts as an intermediary protective barrier during the electroplating process. It prevents direct contact between copper ions and the side surface of the photovoltaic cell, avoiding both edge short circuits and surface damage that would occur with post-etching methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively prevents edge short circuits during copper electroplating in photovoltaic cells, enhancing manufacturing efficiency and reducing damage to the cell surface, thereby improving the overall efficiency and yield of photovoltaic cells.
Implementation Method 1
a mask material is deposited over a side and at least one surface of a photovoltaic device to form a mask material layer
Implementation Method 2
a patterning process is performed on the opening part to form a local opening
Implementation Method 3
metal is electrochemically deposited in the local opening to form an electrode by using an electrochemical deposition method
Data Source
AI summary
Provided is a method for making an electrode of a photovoltaic cell. The method includes the following steps: a mask material is deposited over the side and at least one surface of a photovoltaic device, where the mask material layer is divided into body part and opening part; the opening part is patterned to form a local opening; metal is electrochemically deposited in the local opening to form an electrode; and the body part is removed.