PV Module Power Electronics Layout for Access and Heat Sinking
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Solution Overview
Problem
Current PV solutions face challenges with module level power electronics being difficult to access and service due to their mounting location, and they lack effective heat sinking methodologies.
Innovation Solution
The integration of power electronics within photovoltaic modules using in-frame and in-laminate coupling, along with conductive backsheets and rear contact PV cells, to improve accessibility and heat sinking, and the use of DC-DC converters and control circuits for maximum-power-point-tracking and voltage management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If power electronics are contained within a single junction box on the back of the PV module, then the module structure is simplified, but the electronics become hard to access and service
Solution Approach 1:
The patent divides the power electronics into multiple separate modules distributed across the PV module structure. Each DC-DC converter is associated with specific PV substrings and can be accessed independently, eliminating the single-point bottleneck of traditional junction box designs while maintaining structural organization.
Solution Approach 2:
The patent transitions from a two-dimensional back-mounted junction box to a three-dimensional distributed architecture where electronics are integrated within the module frame and laminate structure. This spatial redistribution enables access from multiple directions and positions, fundamentally improving serviceability.
2Temperature
If power electronics are mounted on the back of the PV module, then the front surface is kept clean, but the electronics do not benefit from heat sinking methodologies
Solution Approach 1:
The patent merges the electronic mounting structure with the PV module frame and laminate structure. The frame and laminate serve dual purposes as both structural support and heat dissipation pathways, eliminating the need for separate mounting hardware while providing thermal management benefits.
Solution Approach 2:
The patent introduces thermally conductive materials and structures as intermediaries between the power electronics and the PV module frame. These intermediary elements facilitate efficient heat transfer from the electronics to the frame, which acts as a heat sink, without requiring direct contact or complex thermal interface solutions.
3Ease of repair
If in-frame and in-laminate coupling is used to integrate power electronics, then accessibility and heat sinking are improved, but the manufacturing process becomes more complex
Solution Approach 1:
The patent segments the integration process into distinct stages: frame coupling during module assembly and laminate coupling during encapsulation. This segmentation allows each integration step to be optimized independently, reducing overall manufacturing complexity despite the multi-stage process.
Solution Approach 2:
The patent designs the coupling structures to serve multiple functions: mechanical support, electrical connection, and thermal management. This multi-functionality reduces the number of separate components and assembly steps required, offsetting the increased complexity of the integration process with component consolidation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances accessibility and reliability of PV module electronics, improves efficiency by mitigating mismatch conditions, and reduces the risk of damage from hot-spotting, while facilitating better heat dissipation.
Implementation Method 1
aspects relate to improved coupling and/or heat sinking for electronics integrated within photovoltaic (PV) modules and/or PV cell arrays
Data Source
AI summary
Aspects of the disclosure relate to incorporation of power electronics with PV modules and PV cell arrays. Further aspects relate to the mounting location of power electronics and the heat sinking of power electronics.