PV Module Encapsulant Crosslinking for Low-Temperature Lamination
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional lamination techniques for photovoltaic modules are incompatible with temperature-sensitive technologies like perovskite and dye-sensitized cells, as they require high temperatures that can damage these cells, and using softer encapsulants at lower temperatures leads to mechanical issues such as delamination due to creep.
Innovation Solution
A method using a silane-modified polyolefin encapsulant material with a cross-linking catalyst, processed at lower temperatures (60° C. to 125° C.) to crosslink and provide sufficient rigidity and resistance to creep, allowing for the lamination of temperature-sensitive PV cells in conventional equipment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional lamination techniques are used with standard encapsulants, then strong bonding and mechanical stability are achieved, but high temperatures (130°C-170°C) damage temperature-sensitive PV cells
Solution Approach 1:
The patent changes the chemical composition parameters of the encapsulant by incorporating silane-modified polyolefin and cross-linking catalyst, enabling the material to achieve strong bonding through chemical cross-linking at lower temperatures (60°C-125°C) rather than relying on high temperature thermal bonding
Solution Approach 2:
The patent creates a composite encapsulant system combining silane-modified polyolefin base resin with cross-linking catalyst and silane coupling agent, where the synergistic interaction between components enables low-temperature cross-linking and bonding without compromising mechanical stability
2Object-affected harmful factors
If softer encapsulants are used to enable low-temperature lamination, then temperature-sensitive PV cells are protected, but mechanical creep and delamination occur at service temperatures
Solution Approach 1:
The patent applies preliminary chemical modification to the encapsulant by incorporating cross-linking catalyst and silane groups before lamination, so that cross-linking occurs during or after the low-temperature lamination process, transforming the material from soft and crepr-prone to rigid and creep-resistant before the module enters service
Solution Approach 2:
The patent utilizes the phase transition of the silane-modified polyolefin from uncross-linked (soft, processable) to cross-linked (rigid, stable) state during the lamination and curing process, enabling the encapsulant to be applied at low temperatures then transform to provide mechanical stability at service temperatures
3Strength
If cross-linking catalyst is added to enable low-temperature lamination with rigidity, then mechanical stability is achieved, but the lamination process becomes more complex
Solution Approach 1:
The patent merges the lamination and cross-linking processes into a single integrated operation by incorporating the cross-linking catalyst and silane groups directly into the encapsulant material before application, so that one lamination step simultaneously achieves both bonding and cross-linking without requiring separate processing stages
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables the production of photovoltaic modules with temperature-sensitive cells using conventional lamination equipment, reducing energy consumption and ensuring mechanical stability and resistance to creep at service temperatures, thus addressing the incompatibility issues with existing technologies.
Implementation Method 1
heating said mixture at a temperature between 60° C. and 125° C. so as to crosslink said base resin
Implementation Method 2
melting said mixture at a temperature between 90° C. and 190° C.
Data Source
AI summary
Method of manufacturing a photovoltaic module comprising at least a first layer and a second layer affixed to each other by means of an encapsulant, said method comprising steps of:providing a lamination device;disposing said first layer in said lamination device,disposing upon said first layer an encapsulant material manufactured by the steps of:providing a base resin comprising a silane-modified polyolefin and having a melting point below 90° C.,forming a mixture of said base resin and an additive comprising a crosslinking catalyst, said cross-linking catalyst being present in a proportion of 0.01 to 5 parts per hundred of resin,melting said mixture at a temperature between 90° C. and 190° C., preferably between 160° C. and 180° C. and extruding said mixture to form said encapsulant material;disposing said second layer upon said encapsulant material,laminating said first layer, said second layer and said encapsulant material under application of heat and pressure, said heat being applied at a temperature between 60° C. and 125° C., preferably between 60° C. and 100° C., further preferably between 70° C. and 90° C. so as to crosslink said base resin.