PV Encapsulant Film Composition for High PID Resistance
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Solution Overview
Problem
Existing encapsulant materials for photovoltaic modules, such as ethylene vinyl acetate (EVA) and olefin-based materials, suffer from low volume resistivity, leading to potential induced degradation (PID) and significant module power loss.
Innovation Solution
A composition comprising an olefin-based polymer with a volume resistivity greater than 5.0*1015 ohm·cm, hydrophobic-treated fumed silica, alkoxysilane, organic peroxide, and a crosslinking co-agent, which results in a film layer with a volume resistivity ranging from 8.0*1017 ohm·cm to 5.0*1018 ohm·cm.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If EVA is used as encapsulant material, then transparency and flexibility are improved, but volume resistivity deteriorates (low VR)
Solution Approach 1:
The patent uses olefin-based polymer as a composite material alternative to EVA, achieving both high transparency and high volume resistivity (>10^17 ohm·cm) through the inherent properties of olefin polymers, thereby resolving the contradiction between transparency and electrical insulation performance
Solution Approach 2:
The patent changes the chemical composition parameter from EVA to olefin-based polymer, which fundamentally alters the volume resistivity parameter from low (EVA) to high (>10^17 ohm·cm) while maintaining transparency, thus resolving the technical contradiction
2Ease of manufacture
If olefin-based encapsulant material with lower VR is used, then ease of manufacture is improved, but PID resistance deteriorates
Solution Approach 1:
The patent changes the volume resistivity parameter from lower values to >10^17 ohm·cm by selecting specific olefin-based polymers, achieving both manufacturability and high PID resistance through this parameter optimization
Solution Approach 2:
The patent applies crosslinking agents locally to the olefin-based polymer to enhance specific properties (adhesion, durability) while maintaining the high volume resistivity characteristic of the base polymer, thus achieving both ease of manufacture and high PID resistance
3Reliability
If encapsulant material with improved VR is used, then PID resistance is improved, but manufacturing complexity increases
Solution Approach 1:
The patent achieves high PID resistance through parameter selection (olefin-based polymer with VR >10^17 ohm·cm) rather than complex manufacturing processes, maintaining simplicity while improving reliability
Solution Approach 2:
The olefin-based polymer inherently provides high volume resistivity and PID resistance without requiring additional complex treatments or layers, allowing the material to serve its own insulation function while remaining easy to manufacture
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly enhances the volume resistivity of the film layer, improving PID resistance and reducing power loss in photovoltaic modules.
Implementation Method 1
hydrophobic-treated fumed silica
Implementation Method 2
crosslinking co-agent
Data Source
AI summary
A composition for use as a film layer comprises (A) an olefin-based polymer having a volume resistivity greater than 5.0*1015 ohm·cm; (B) a hydrophobic-treated fumed silica; (C) an alkoxysilane; (D) an organic peroxide; and (E) from 0 wt % to 1.5 wt % of a crosslinking co-agent.