Photovoltaic Conducting Layer Interconnects for Thin-Cell Connections
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Solution Overview
Problem
Existing photovoltaic devices face challenges in forming efficient electrical connections between neighboring cells, which impact performance and manufacturability, and current methods like laser forming of contact regions are unsuitable for commercial production.
Innovation Solution
A method involving laser processing to form conducting layer interconnects through a dielectric layer, using a Gaussian-shaped laser pulse to selectively delaminate and melt the dielectric layer over a conducting layer, creating a via and contact region for electrical connection, allowing for efficient manufacturing of photovoltaic devices with thin conducting layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional photolithographic or PCB laser techniques are used to form electrical connections, then manufacturing processes are established, but they are unsuitable for commercial production due to limitations in efficiency and scalability
Solution Approach 1:
The patent replaces conventional photolithographic and PCB laser techniques with a novel laser processing method that uses a Gaussian-shaped laser pulse to selectively delaminate and melt the dielectric layer. This substitution enables high-throughput production by creating precise contact regions and vias through controlled thermal processing, making the manufacturing process suitable for commercial photovoltaic production
Solution Approach 2:
The invention changes the laser processing parameters by using a Gaussian-shaped laser pulse with specific temporal and spatial characteristics. This parameter change allows selective delamination and melting of the dielectric layer to form contact regions, achieving both high precision and high manufacturing throughput for commercial production
2Reliability
If thin conducting layers are used in photovoltaic devices, then device performance is improved, but forming reliable electrical connections becomes more difficult
Solution Approach 1:
The patent applies preliminary action by using laser processing to pre-form contact regions within the thin conducting layer before final assembly. The Gaussian-shaped laser pulse selectively melts and delaminates the dielectric layer to create defined contact areas, ensuring reliable electrical connections are established beforehand in the thin conducting layer structure
Solution Approach 2:
The invention utilizes phase transitions by applying a laser pulse that selectively melts the dielectric layer over the conducting layer. This controlled phase transition from solid to liquid and subsequent rapid cooling creates well-defined contact regions with improved reliability for electrical connections in thin conducting layers
3Manufacturing precision
If laser processing is used to form contact regions, then precise electrical connections are achieved, but the process is unsuitable for commercial production due to complexity
Solution Approach 1:
The patent achieves universality by using a single Gaussian-shaped laser pulse process that performs multiple functions: it selectively delaminates the dielectric layer, melts the conducting layer to form contact regions, and creates vias through the dielectric layer. This multi-functional approach maintains manufacturing precision while reducing overall process complexity for commercial production
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables robust and efficient electrical connections between photovoltaic cells without the limitations of photolithographic or PCB laser techniques, facilitating high-throughput production of photovoltaic devices with controlled current flow.
Implementation Method 1
An affected region of the conducting layer can be heated with a laser pulse. The laser pulse can be selected to promote selective delamination of a portion of the dielectric layer over the affected region of the conducting layer
Implementation Method 2
The affected region of the conducting layer can be, at least partially, melted
Data Source
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AI summary
According to the embodiments provided herein, a photovoltaic device can have one or more cells with a conducting layer interconnect.