Photovoltaic Laminate Metallization With Laser-Fired Foil Bonding
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Solution Overview
Problem
Current metallization techniques for solar cells in photovoltaic modules require multiple steps, including physical deposition, annealing, and soldering, which increase manufacturing costs and reduce output yield, necessitating a more efficient method for forming metal bonds and interconnects.
Innovation Solution
A single-step process involving a metal bond coupling a solar cell to a metal foil, where the metal foil is uniformly contacted and bonded to the solar cell using techniques such as laser firing, allowing for the formation of a metal contact region and subsequent patterning of busbars and ribbons, thereby simplifying the metallization process and reducing the number of manufacturing steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple-step metallization techniques (physical deposition, annealing, soldering) are used, then reliable metal bonds and interconnects are formed, but manufacturing costs increase and output yield decreases
Solution Approach 1:
The patent combines multiple metallization steps (physical deposition, annealing, and soldering) into a single integrated process step. The metallization layer is applied in one operation that simultaneously achieves deposition, bonding, and interconnect formation, eliminating the need for separate annealing and soldering steps while maintaining reliable metal bonds and interconnects.
Solution Approach 2:
The metallization process is designed to perform multiple functions simultaneously: it creates the metal bond between components, forms the interconnect structure, and establishes electrical connections all in one step. This multi-functional approach replaces the sequential specialized steps of traditional metallization with a single universal process.
2Reliability
If multiple-step metallization techniques are used, then reliable metal bonds and interconnects are formed, but manufacturing costs increase
Solution Approach 1:
The patent combines multiple metallization steps (physical deposition, annealing, and soldering) into a single integrated process step. The metallization layer is applied in one operation that simultaneously achieves deposition, bonding, and interconnect formation, eliminating the need for separate annealing and soldering steps while maintaining reliable metal bonds and interconnects.
Solution Approach 2:
The patent extracts and eliminates the separate annealing and soldering steps from the traditional metallization process, retaining only the essential metallization deposition step that can perform all necessary functions in one operation, thereby reducing manufacturing complexity and cost.
3Productivity
If a single-step metallization process is used, then manufacturing costs decrease and output yield increases, but the complexity of forming reliable metal bonds and interconnects increases
Solution Approach 1:
The metallization process is designed to perform multiple functions simultaneously: it creates the metal bond between components, forms the interconnect structure, and establishes electrical connections all in one step. This multi-functional approach replaces the sequential specialized steps of traditional metallization with a single universal process.
Solution Approach 2:
The patent replaces the complex mechanical and thermal processes of traditional metallization (multiple deposition cycles, annealing furnaces, soldering equipment) with a single metallization application process that achieves all desired outcomes through one operation, simplifying the manufacturing system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs and increases output yield by streamlining the metallization process, enabling the formation of efficient metal bonds and interconnects in a single step, thus enhancing the fabrication efficiency of photovoltaic laminates and modules.
Implementation Method 1
forming a metal bond can include firing a laser through the receiving medium to the metal foil to form a metal bond or a metal contact region that couples the metal foil to the first solar cell
Data Source
AI summary
A photovoltaic laminate is disclosed. Embodiments include placing a first encapsulant on a substantially transparent layer that includes a front side of a photovoltaic laminate. Embodiments also include placing a first solar cell on the first encapsulant. Embodiments include placing a metal foil on the first solar cell, where the metal foil uniformly contacts a back side of the first solar cell. Embodiments include forming a metal bond that couples the metal foil to the first solar cell. In some embodiments, forming the metal bond includes forming a metal contact region using a laser source, wherein the formed metal contact region electrically couples the metal foil to the first solar cell. Embodiments can also include placing a backing material on the metal foil. Embodiments can further include forming a back layer on the backing material layer and curing the substantially transparent layer, first encapsulant, first solar cell, metal foil, backing material and back layer to form a photovoltaic laminate.