Photovoltaic Module PCB Failsafe Using Low-Melting Alloy Bypass
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Photovoltaic modules face issues such as reduced electricity generation, increased electrical resistance, and component degradation due to excessive temperatures and malfunctions, which existing bypass diodes fail to adequately address, leading to potential damage and reduced efficiency.
Innovation Solution
Incorporation of low melting temperature alloys and temperature-activated switches into a printed circuit board to provide failsafe functionality, allowing for shorting or opening of circuitry when threshold temperatures are reached, thereby protecting photovoltaic substrings from overheating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bypass diodes are used to protect photovoltaic substrings, then reliability is improved, but device complexity increases
Solution Approach 1:
The patent changes the physical state parameter of the alloy material from solid to liquid at a specific temperature threshold. This parameter change enables the alloy to flow and create conductive paths that short out bypass diodes when overheating occurs, providing automatic protection without adding complex control circuitry
Solution Approach 2:
The patent replaces the electronic control system with a passive thermal-mechanical system. The alloy's phase change from solid to liquid in response to temperature changes automatically triggers the shorting function, eliminating the need for active electronic sensors, microcontrollers, or switching mechanisms
2Temperature
If low melting alloys are used for failsafe functionality, then temperature protection is improved, but manufacturing precision requirements increase
Solution Approach 1:
The alloy connections are pre-established during manufacturing between specific contact pads. The alloy is placed in advance in positions that will automatically form conductive paths when melted, so that no additional positioning or alignment is needed during the protection event - the geometry is predetermined by the manufacturing layout
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively provides failsafe protection by shorting or opening circuitry to prevent damage to photovoltaic modules, maintaining efficiency and safety by bypassing overheated diodes and reducing the risk of hotspots and component failure.
Implementation Method 1
when the first low melting alloy and the second low melting alloy reach a threshold temperature based on an event affecting the at least one bypass diode, the first low melting alloy and the second low melting alloy melt towards each other in the channel
Implementation Method 2
the printed circuit board further comprises a temperature-activated switch in proximity to the at least one bypass diode. In certain embodiments, the temperature-activated switch is configured to close the circuitry and bypass the at least one bypass diode when the threshold temperature is reached based on the event
Data Source
AI summary
A system includes photovoltaic modules including a plurality of substrings installed on a roof deck. A printed circuit board of the system includes a bypass diode, a plurality of solder pads, and first and second low melting alloys connecting first and second solder pads. When the first and second low melting alloys reach a threshold temperature based on the occurrence of an event affecting the bypass diode, the first and second low melting alloys melt towards each other in a channel such that the first and second low melting allows connect to each other to form a continuous path between the first and second solder pads. The formed continuous path causes shorting of circuitry connecting at least one of the plurality of photovoltaic substrings to the first and second solder pads to provide a failsafe for at least one of the plurality of substrings.