Photovoltaic Module Encapsulation Layout for Low-Shading Cell Connections

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Solution Overview

Problem

Existing photovoltaic modules face issues with electrode arrangement and welding strip connections that affect photoelectric conversion efficiency, yield, and manufacturing costs, due to shading, high material costs, and poor contact caused by high-temperature welding.

Innovation Solution

A photovoltaic module design with secondary grid lines and low-temperature welding strips, combined with encapsulation layers having varying flowability, to reduce shading and improve contact reliability during lamination.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If traditional high-temperature welding strips are used to connect electrodes, then connection strength is improved, but contact reliability deteriorates due to poor contact caused by high-temperature welding

Engineering Contradiction:
Improveconnection strengthVSAvoidcontact reliability
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The patent changes the temperature parameter from high-temperature welding to low-temperature welding, using a low-temperature welding strip that enables connection at lower temperatures to avoid damage to the electrodes while maintaining connection strength and improving contact reliability

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs a composite encapsulation structure with two different encapsulation materials having different flowability characteristics. The first encapsulation material has lower flowability to prevent flow during lamination, while the second encapsulation material has higher flowability to ensure good contact, creating a composite system that resolves the contradiction between connection strength and contact reliability

Inventive Principle:
Principle #40Composite materials

2Device complexity

If traditional electrode arrangement is used, then structural simplicity is maintained, but photoelectric conversion efficiency deteriorates due to shading

Engineering Contradiction:
Improvestructural simplicityVSAvoidphotoelectric conversion efficiency
Core Design Contradiction:
Device complexityVSLoss of energy

Solution Approach 1:

The patent optimizes the geometric parameters of the electrodes, changing their width, spacing, and arrangement pattern to reduce the total shading area while maintaining structural simplicity, thereby improving photoelectric conversion efficiency without significantly complicating the structure

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent introduces a new dimension to the electrode arrangement by using multi-level or three-dimensional positioning of electrodes, allowing for reduced shading in the two-dimensional plane while maintaining structural simplicity through vertical or diagonal arrangements

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Ease of manufacture

If single-layer encapsulation is used, then manufacturing simplicity is maintained, but connection reliability deteriorates due to flow during lamination

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidconnection reliability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent segments the single-layer encapsulation into two distinct encapsulation layers with different functional characteristics. The first layer provides structural support and prevents flow during lamination, while the second layer ensures good contact and connection reliability, thereby resolving the contradiction between manufacturing simplicity and connection reliability

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent applies different local qualities to different regions of the encapsulation structure. The first encapsulation material has lower flowability suited for the region requiring flow prevention, while the second encapsulation material has higher flowability suited for the region requiring good contact, optimizing both manufacturing and reliability

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design reduces material costs, enhances photoelectric conversion efficiency, and increases yield by minimizing shading and ensuring reliable connections between electrodes and welding strips, while extending the service life of the modules.

Implementation Method 1

flowability of the first encapsulation sub-layer is smaller than flowability of the second encapsulation sub-layer

Methodology Applied
Scientific EffectFlowability: Viscometer

Implementation Method 2

electrodes are used to collect and export electrons generated by the photovoltaic effect

Methodology Applied
Scientific EffectPhotovoltaic effect: Photovoltaic Effect

Data Source

PatentUS12581749B2Photovoltaic module and method for manufacturing photovoltaic module
Publication Date: 2026.03.17 ZHEJIANG JINKO SOLAR CO LTD
  • US12581749B2 patent drawing
  • US12581749B2 patent drawing
  • US12581749B2 patent drawing

AI summary

A photovoltaic module and a method for manufacturing the photovoltaic module are provided. A respective solar cell has a front surface and a rear surface opposite to the front surface, each of which has a plurality of electrodes formed thereon. Each connection member of the plurality of connection members is configured to connect two adjacent solar cells of the plurality of solar cells and has a first end portion disposed over the front surface of a first solar cell of the two adjacent solar cells and a second end portion disposed over the rear surface of a second solar cell of the two adjacent solar cells. Each encapsulation layer includes a first encapsulation sub-layer and a second encapsulation sub-layer, where flowability of the first encapsulation sub-layer is smaller than flowability of the second encapsulation sub-layer.