PV Module Encapsulant Composite Resolving Delamination and Moisture Barrier Trade-offs
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Solution Overview
Problem
Conventional encapsulants for PV modules, such as ethylene vinyl acetate copolymers, suffer from low moisture barrier properties, leading to delamination and corrosion issues due to hydrolysis reactions, especially under high temperature and humidity conditions, and have low heat resistance, which affects the long-term reliability and efficiency of solar cell modules.
Innovation Solution
An encapsulant comprising an ethylene/α-olefin-based copolymer, a silane modified ethylene/α-olefin-based copolymer, and a heat-resistant polymer resin with a melting point between 100°C to 150°C, specifically low-density polyethylene, is used to enhance adhesion, prevent delamination, and maintain transparency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If ethylene vinyl acetate copolymer is used as encapsulant, then formability and manufacturing cost are improved, but moisture barrier properties and adhesive strength deteriorate under high temperature and humidity conditions
Solution Approach 1:
The patent uses a composite material system consisting of ethylene/α-olefin copolymer as the base resin and silane-modified ethylene/α-olefin copolymer as the additive. This composite approach combines the excellent formability and cost-effectiveness of ethylene/α-olefin copolymer with the superior moisture barrier properties and adhesion of silane-modified copolymer, resolving the contradiction between ease of manufacture and reliability.
2Reliability
If ethylene/α-olefin-based copolymer is used as encapsulant, then moisture barrier properties are improved, but adhesion and heat resistance deteriorate due to low melting point
Solution Approach 1:
The patent optimizes the melting point parameter of the encapsulant material by selecting ethylene/α-olefin copolymer with controlled composition and adding silane-modified copolymer. This parameter adjustment raises the melting point from the typical low range of ethylene/α-olefin copolymers to a range that provides adequate heat resistance while maintaining moisture barrier properties and adhesion.
3Ease of manufacture
If encapsulant with low melting point is used, then formability is improved, but heat resistance and delamination resistance deteriorate under long term use
Solution Approach 1:
The patent creates a composite encapsulant material combining ethylene/α-olefin copolymer (providing formability) with silane-modified ethylene/α-olefin copolymer (providing heat resistance and delamination resistance). The synergistic effect of this composite material system achieves both good formability during manufacturing and long-term durability under thermal stress.
4Illumination intensity
If encapsulant transparency is improved, then light absorption is enhanced, but adhesion and heat resistance may deteriorate
Solution Approach 1:
The patent carefully controls the chemical composition and molecular structure parameters of the ethylene/α-olefin copolymer and silane-modified copolymer to achieve a balance between transparency and performance. By adjusting the copolymer composition ratio and molecular weight distribution, the material maintains high light transmittance while ensuring adequate adhesion and heat resistance through the silane modification.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The encapsulant exhibits improved adhesion, heat resistance, and transparency, reducing delamination and corrosion, thereby enhancing the durability and efficiency of PV modules by maintaining excellent physical properties under high temperature and humidity conditions.
Implementation Method 1
a silane modified ethylene/α-olefin-based copolymer
Implementation Method 2
a heat resistant polymer resin having a melting point (Tm) in a range of 100 to 150°C and which is higher than the melting point of the ethylene/α-olefin-based co-polymer
Implementation Method 3
the ethylene vinyl acetate copolymer causes the corrosion of electrodes by generating a hydrolysis reaction due to the penetration of moisture
Data Source
Figure 1~2
Figure 3~4
AI summary
The present application relates to an encapsulant for a PV module, a method of manufacturing the same, and a PV module. The encapsulant according to an embodiment of the present application has excellent heat resistance or the like and improved creep properties, exhibits a haze with a certain level or less and excellent optical properties such as transparency or the like, when the encapsulant is applied to a PV module, physical properties such as durability, transparency, or the like are improved, and thus excellent generating efficiency of the PV module may be obtained.