Photovoltaic Power Optimizer Housing for Heat Dissipation and Insulation
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Solution Overview
Problem
Conventional electronic apparatuses face inefficiencies in heat dissipation due to insulation structures that compromise heat conduction, leading to poor thermal management and increased space and manufacturing costs.
Innovation Solution
An electronic apparatus design featuring a circuit board with heat dissipation regions on both surfaces, wrapped by a heat dissipation housing with solid-state members in direct contact, and an insulation member to ensure stability and insulation performance, enhanced by ventilation gaps and clamping mechanisms.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If insulation structures such as insulation films or ceramic substrates are used to ensure insulation, then insulation performance is improved, but heat conduction efficiency deteriorates
Solution Approach 1:
The heat dissipation housing is divided into multiple independent heat dissipation members (first heat dissipation member, second heat dissipation member, third heat dissipation member) that are arranged in different spatial directions. Each member independently contacts heat dissipation regions on the circuit board, segmenting the heat dissipation function across multiple components rather than relying on a single insulation structure.
Solution Approach 2:
Heat dissipation is achieved not only in the vertical direction (first heat dissipation member contacting front surface) but also in lateral dimensions (second heat dissipation member contacting side surface, third heat dissipation member contacting rear surface). This multi-dimensional heat dissipation approach bypasses the limitation of conventional single-direction insulation structures.
2Temperature
If conventional heat sinks are used for heat dissipation, then heat dissipation capability is improved, but space requirements and manufacturing costs increase
Solution Approach 1:
The heat dissipation housing integrates multiple functions: it provides structural support, electrical insulation, and heat dissipation. The heat dissipation members are embedded within the housing structure itself rather than being separate add-on components, merging the housing and heat sink functions into a single integrated assembly.
Solution Approach 2:
The heat dissipation housing serves multiple purposes simultaneously: it acts as the structural enclosure for the circuit board, provides electrical insulation between conductive parts, and functions as a heat sink through the embedded heat dissipation members. This multi-functionality eliminates the need for separate heat sink components.
3Reliability
If insulation structures are placed between heat dissipation paths, then insulation is ensured, but thermal resistance increases
Solution Approach 1:
The heat dissipation members act as intermediary components that bridge the circuit board and the housing. These members are made of thermally conductive materials that facilitate heat transfer from the circuit board through the housing structure, serving as thermal mediators that reduce thermal resistance compared to conventional insulation-based approaches.
Solution Approach 2:
The heat dissipation housing employs composite construction combining insulating housing material with thermally conductive heat dissipation members. This composite structure allows simultaneous achievement of electrical insulation (through the housing material) and thermal conduction (through the heat dissipation members), reducing overall thermal resistance while maintaining insulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves heat dissipation performance while maintaining insulation, reducing thermal resistance, and preventing conductive interference, thus stabilizing the electronic apparatus operation.
Implementation Method 1
The first heat dissipation member has a first heat dissipation surface that is in direct contact with the first heat dissipation region. The second heat dissipation member is connected to the first heat dissipation member in a first direction, and has a second heat dissipation surface that is in direct contact with the second heat dissipation region.
Implementation Method 2
The insulation member wraps the heat dissipation housing.
Data Source
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AI summary
This application provides an electronic apparatus and a photovoltaic power optimizer. The electronic apparatus includes a circuit board, a heat dissipation housing, and an insulation member. The circuit board has a first surface and a second surface opposite to each other, where a first heat dissipation region is formed on the first surface and a second heat dissipation region is formed on the second surface. The heat dissipation housing includes a first heat dissipation member and a second heat dissipation member. The insulation member wraps the heat dissipation housing. The first heat dissipation member has a first heat dissipation surface that is in direct contact with the first heat dissipation region. The second heat dissipation member is connected to the first heat dissipation member in a first direction, and has a second heat dissipation surface that is in direct contact with the second heat dissipation region. The first heat dissipation region and the second heat dissipation region are sealed by using the first heat dissipation member and the second heat dissipation member. The first heat dissipation member and the second heat dissipation member dissipate heat on the circuit board by being in direct contact with the heat dissipation regions of the circuit board, to improve heat dissipation performance of the circuit board. On the basis of ensuring the heat dissipation performance of the circuit board, insulation performance of the electronic apparatus is ensured by wrapping the heat dissipation housing by using the insulation member.