Photovoltaic Optimizer Package Layout With Thermal Isolation Partition
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Solution Overview
Problem
In package structures, such as photovoltaic optimizers, heat dissipation challenges arise when a high-temperature heating device overheats adjacent low-temperature devices due to direct heat transfer through conductive materials, compromising the reliability of the overall system.
Innovation Solution
Incorporating a heat insulation part that separates high-temperature and low-temperature devices, with a cavity filled with gas to reduce thermal conductivity and enhance heat blocking, while using heat conductive mediums and protrusions to accelerate heat dissipation, thereby preventing overheating and ensuring reliable operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If heat conductive material is filled as a whole inside the housing to improve heat dissipation, then overall heat dissipation capability is improved, but heat from heating device is transferred to nearby low-temperature device causing overheating
Solution Approach 1:
The housing internal space is segmented into a first heat dissipation cavity and a second heat dissipation cavity by the heat insulation partition. The first cavity accommodates the heating device while the second cavity accommodates the low-temperature device, preventing direct heat transfer between them while maintaining overall heat dissipation capability through separate controlled environments.
Solution Approach 2:
The heat insulation partition acts as an intermediary element between the heating device and the low-temperature device. It blocks the direct thermal pathway that would otherwise allow heat from the high-temperature device to transfer to the temperature-sensitive device, thereby protecting the low-temperature device while still allowing both to coexist in the same housing.
2Reliability
If heat insulation part is introduced to separate heating devices, then heat transfer between devices is reduced, but device complexity increases
Solution Approach 1:
The heat insulation partition is implemented as a thin-walled structure that extends from the bottom wall to the top wall of the housing, effectively separating the two cavities without adding substantial bulk or complexity. This thin-film approach provides effective thermal isolation while maintaining structural simplicity and minimizing space occupation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively slows down heat transfer between high-temperature and low-temperature devices, preventing overheating and ensuring the reliability of low-temperature components, while improving overall heat dissipation efficiency within the package structure.
Implementation Method 1
a heat insulation part... the heat insulation part separates the first heating device and the second heating device... prevent heat dissipated by the first heating device from being directly transferred to the second heating device
Implementation Method 2
there may be a cavity inside the heat insulation part, and the cavity may be filled with gas in contact with the first housing. In this way, a coefficient of thermal conductivity of the heat insulation part can be reduced, and an effect of blocking heat transfer by the heat insulation part can be enhanced
Implementation Method 3
the first housing is filled with a heat conductive medium, and the heat conductive medium fills internal space of the first housing. In this way, heat dissipation of the first heating device and the second heating device can be accelerated
Data Source
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AI summary
A package structure and a photovoltaic optimizer are provided. The package structure includes a first housing, a circuit board, and a heat insulation part. The circuit board is disposed inside the first housing, a first heating device and a second heating device may be disposed on a first surface of the circuit board at an interval, and heat generated by the first heating device at maximum power is greater than heat generated by the second heating device at maximum power. A first end of the heat insulation part may be located on a side wall, of the first housing, opposite to the first surface of the circuit board, a second end of the heat insulation part may extend toward the first surface of the circuit board, and the heat insulation part separates the first heating device and the second heating device on two sides of the heat insulation part. The heat insulation part separates the first heating device from the second heating device, to slow down heat transfer from the first heating device to the second heating device, thereby alleviating a phenomenon of baking the second heating device by the first heating device, preventing the second heating device from overheating due to baking by the first heating device, and ensuring operating reliability of the package structure.