Thermally Conductive Substrate Electronics Assembly for PV Panel Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional solar power systems face issues with heat dissipation due to dirt accumulation and the complexity and cost of cooling structures, leading to reduced efficiency and potential electronics failure in photovoltaic panels, especially when mounted on roofs for extended periods.
Innovation Solution
A thermally conductive substrate-based electronics assembly that uses the photovoltaic panel as a heat sink, with a cover designed to minimize dirt accumulation and eliminate the need for expensive cooling structures, allowing efficient heat dissipation even in poorly ventilated conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cooling structures (cooling fins, air gaps) are used to dissipate heat from electronics, then heat dissipation capability is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges the electronics module housing with the cooling function by making the housing itself thermally conductive and in direct thermal contact with the PV panel. The housing serves dual purposes: protecting electronics and dissipating heat, eliminating the need for separate cooling fins or air gap structures.
Solution Approach 2:
The housing is designed to perform multiple functions simultaneously: mechanical protection of electronic components, structural support, and thermal management through heat dissipation to the PV panel. This multi-functionality reduces overall device complexity.
2Temperature
If conventional cooling structures are used for heat dissipation, then heat dissipation capability is improved, but manufacturing cost increases
Solution Approach 1:
By combining the housing and cooling functions into a single integrated structure, the patent eliminates the need for separate cooling components, reducing part count, assembly steps, and manufacturing cost while maintaining effective heat dissipation.
Solution Approach 2:
The PV panel itself serves as the heat sink, utilizing its inherent thermal mass and conductivity to dissipate heat from the electronics without requiring additional active cooling systems or expensive thermal management components.
3Temperature
If electronics are thermally isolated from the PV panel, then heat dissipation to surrounding air is improved, but reliability decreases due to dirt accumulation on cooling structures
Solution Approach 1:
The patent extracts the heat dissipation function from the air interface and relocates it to the PV panel contact interface. By taking the cooling function away from exposed air-facing surfaces, the system eliminates the reliability problem of dirt accumulation blocking heat transfer pathways.
Solution Approach 2:
The PV panel acts as an intermediary heat sink between the electronics and the environment. Heat is transferred from electronics through the housing to the PV panel, which then dissipates heat to the environment through its own surfaces, preventing direct contamination of the cooling pathway.
4Reliability
If the cover area is large to protect electronic components, then protection capability is improved, but heat dissipation efficiency decreases due to reduced thermal contact area
Solution Approach 1:
The patent applies local quality by having the cover protect only the specific areas where electronic components are mounted, while leaving the edges and peripheral areas of the housing exposed for optimal thermal contact with the PV panel. This localized protection approach maintains both protection and heat dissipation efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a simple, cost-effective, and stable thermal management system that maintains the photovoltaic panel's efficiency by effectively dissipating heat generated by electronic components, reducing the risk of electronics failure and extending system lifespan.
Implementation Method 1
the substrate provides a heat conductive channel between the electronic components and the photovoltaic panel
Implementation Method 2
the heat dissipated by the electronics module mounted to the back of the PV panel is typically transported away from the PV panel towards the surrounding air using the mechanisms of convective and radiative heat transfer
Implementation Method 3
the heat dissipated by the electronics module mounted to the back of the PV panel is typically transported away from the PV panel towards the surrounding air using the mechanisms of convective and radiative heat transfer
Data Source
AI summary
An electronics assembly for a photovoltaic panel includes a substrate of a thermally conductive material, wherein the substrate defines a thermal contact area for thermally contacting the electronics assembly to a photovoltaic panel; and at least one electronic component provided on the substrate and in thermal contact with the substrate, so that when the electronics assembly is in thermal contact with the photovoltaic panel. The thermal contact provides a heat conductive channel between the at least one electronic component and the photovoltaic panel, wherein the heat conductive channel enables the electronics assembly to use the photovoltaic panel as a heat sink for heat produced by the at least one electronic component.