Photovoltaic Module Solder Pad Pre-Coating for Stable Cell Interconnection
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Solution Overview
Problem
Current photovoltaic modules face reliability issues due to false soldering or unsoldering between connecting members and solder pads, leading to instability in electrical connections, which can be attributed to the high cost and difficulty in controlling solder paste usage, as well as the generation of conductive foreign matters during the manufacturing process.
Innovation Solution
A method is introduced where a solder layer with a first alloy layer of tin and a metal element is formed on the solder pads before connecting members are placed, reducing the spacing between them and improving the stability of the electrical connection. This solder layer is formed using a tin feeder or tinning machine, with controlled thickness and area to enhance the reliability and safety of the module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If solder paste is used for connecting members, then assembly is simplified, but control over solder usage becomes difficult and conductive foreign matters are generated
Solution Approach 1:
The patent applies local quality by coating solder only on the specific solder pads where it is needed, rather than using solder paste that requires precise placement. The coating process ensures uniform distribution only in the required areas, preventing excess solder and conductive foreign matters while maintaining assembly simplicity.
Solution Approach 2:
The patent extracts the solder application step from the assembly process by pre-coating the solder pads. This separation allows the solder to be applied under controlled conditions before assembly, eliminating the complexity of controlling solder paste during assembly while maintaining ease of manufacture.
2Reliability
If high temperature soldering is performed to ensure connection, then electrical connection is achieved, but risk of performance damage increases
Solution Approach 1:
The patent applies preliminary action by pre-forming the solder layer on solder pads before assembly. This allows the solder to be in optimal condition for bonding, enabling reliable connections at lower temperatures and reducing thermal damage risk to the photovoltaic cells and other sensitive components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method reduces the probability of false soldering, minimizes the generation of conductive foreign matters, and lowers the process risk, thereby improving the reliability and safety of the photovoltaic module by stabilizing the electrical connections and reducing the risk of performance damage during the welding process.
Implementation Method 1
coating each solder pad with molten solder for forming the corresponding solder layer after cooling
Implementation Method 2
performing a soldering treatment on the respective connecting member and the respective pair of adjacent cells
Data Source
AI summary
Embodiments of the disclosure provide a method for manufacturing a photovoltaic module and a photovoltaic module. The method includes the following: providing a plurality of cells; selecting at least one cell from the plurality of cells, and for each respective cell of the at least one cell, forming a corresponding solder layer on each respective solder pad of at least one solder pad of the respective cell; and performing a soldering treatment on the respective connecting member and the at least one solder pad and/or the at least one solder layer to connect the respective pair of adjacent cells, wherein the soldering treatment has a heating temperature in a range of 200° C. to 300° C.