PVC Insulated Wire Bonding Layer for Delamination Resistance

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional insulated wires with polyvinyl chloride insulating coatings and modified polyolefin resin bonding layers experience weak adhesive strength, leading to delamination and reduced load-bearing capacity when subjected to external loads.

Innovation Solution

Incorporating a polyamide resin, preferably a nylon-based hot-melt resin, into the bonding layer to enhance the adhesive strength between the insulating coating and the bonding layer, with a composition that includes a modified polyolefin resin and a polyamide resin, ensuring excellent thermal bonding properties and improved chemical resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If a modified polyolefin resin bonding layer is used to fix the insulated wire directly without fixing hardware, then space is saved, but the adhesive strength between the insulating coating layer and bonding layer is weak causing delamination

Engineering Contradiction:
Improvespace occupied by fixing hardwareVSAvoidadhesive strength between insulating coating layer and bonding layer
Core Design Contradiction:
Volume of moving objectVSStrength

Solution Approach 1:

The bonding layer is formulated as a composite material comprising modified polyolefin resin (30-70 mass%) and polyamide resin (70-30 mass%), where the polyamide resin provides strong adhesion to the polyvinyl chloride insulating coating layer while the modified polyolefin resin provides bonding capability. This composite structure resolves the contradiction by combining materials with complementary properties to achieve both direct fixation and strong adhesive strength.

Inventive Principle:
Principle #40Composite materials

2Device complexity

If the bonding layer is provided on the outer side of the insulating coating layer for direct fixation, then fixing hardware is eliminated, but delamination occurs at the interface when load is applied

Engineering Contradiction:
Improvenumber of fixing hardware componentsVSAvoidinterface stability between insulating coating layer and bonding layer
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The composite bonding layer with polyamide resin provides reliable interface stability under load while eliminating fixing hardware. The polyamide resin specifically targets the adhesion requirement to prevent delamination, allowing direct fixation without compromising reliability.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The invention changes the chemical composition parameters of the bonding layer by incorporating polyamide resin with specific adhesion properties to polyvinyl chloride, transforming the bonding mechanism from weak physical adhesion to strong chemical adhesion, thereby ensuring interface stability under operational loads.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The insulated wire with a polyamide resin-based bonding layer exhibits superior adhesive strength, dispersing loads effectively and preventing delamination, thus maintaining wire integrity under external loads without the need for additional fixing hardware.

Implementation Method 1

a bonding layer that is provided on an outer side of the insulating coating layer and is bonded by heat

Methodology Applied
Scientific EffectThermal bonding: Heating

Data Source

PatentUS12014849B2Insulated wire with bonding layer of polyolefin and polyamide
Publication Date: 2024.06.18 AUTONETWORKS TECH LTD
  • US12014849B2 patent drawing
  • US12014849B2 patent drawing
  • US12014849B2 patent drawing

AI summary

An insulated wire with bonding layer includes: a conductor; an insulating coating layer that covers an outer circumference of the conductor; and a bonding layer that is provided on an outer side of the insulating coating layer and is bonded by heat, wherein the insulating coating layer contains polyvinyl chloride, and the bonding layer contains a modified polyolefin resin and a polyamide resin.