Tall Deposition Ring Structure for PVD Backside Sticking
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Solution Overview
Problem
In physical vapor deposition (PVD) chambers, the process kit shield accumulates deposited material, leading to adherence and sticking issues on the substrate backside, causing handling problems and frequent downtime for replacement.
Innovation Solution
A deposition ring design with an annular band, inner and outer lips, and a channel structure that increases material accumulation capacity and includes a clamp assembly to prevent adherence to the substrate, allowing for more process cycles before cleaning and reducing substrate damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a process kit shield is used in a PVD chamber to separate processing volume from non-processing volume, then the shield effectively performs the separation function, but the shield accumulates deposited material leading to frequent replacement downtime
Solution Approach 1:
The deposition ring is designed as a separate, removable component that can be independently cleaned and replaced without replacing the entire process kit shield. This segmentation allows the deposition ring to be maintained separately, reducing overall downtime while preserving the shield's separation function.
Solution Approach 2:
The deposition ring acts as an intermediary component between the process kit shield and the substrate. It absorbs the accumulation of deposited material, preventing direct contact between the substrate backside and the shield, thereby eliminating adhesion issues while the shield continues its separation function.
2Strength
If deposition material accumulates on the process kit shield, then the shield maintains its structural integrity, but the deposition adheres to the substrate backside causing handling issues and broken substrates
Solution Approach 1:
The deposition ring serves as a mediator that intercepts deposited material before it can reach the substrate backside. The ring's structure allows material accumulation on its upper surface and vertical sides, creating a physical barrier that prevents adhesion between the substrate and process kit shield, thereby eliminating handling issues and substrate breakage.
3Reliability
If the process kit shield is replaced frequently to prevent substrate adhesion, then substrate handling reliability is maintained, but productivity decreases due to frequent replacements
Solution Approach 1:
By segmenting the deposition ring as a separate removable component, the system allows frequent cleaning or replacement of only the deposition ring rather than the entire process kit shield. This maintains substrate handling reliability while minimizing productivity loss, as the deposition ring can be quickly maintained without full shield replacement.
Solution Approach 2:
The deposition ring is designed to be easily removed, cleaned, and reused. Instead of discarding the entire process kit shield, only the deposition ring is discarded (or cleaned and recovered), allowing multiple process cycles to be completed with the same shield assembly, thereby maintaining productivity while ensuring substrate handling reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The deposition ring design reduces material adherence to the substrate backside, enabling more process cycles and minimizing downtime by accommodating increased deposition without sticking, while the clamp assembly prevents lifting and damage during substrate handling.
Implementation Method 1
In physical vapor deposition (PVD) chambers, the process kit shield accumulates deposited material
Data Source
AI summary
Embodiments of a process kit are provided herein. In some embodiments, a deposition ring includes: an annular band having an upper surface and a lower surface, wherein the annular band includes a radially inner portion and a radially outer portion, wherein the lower surface includes a step that extends downward from the radially inner portion to the radially outer portion, wherein the step is disposed closer to a radially outermost surface of the annular band than a radially innermost surface of the annular band; an inner lip extending upwards from the upper surface of the annular band, and wherein the upper surface of the inner lip is an uppermost surface of the deposition ring; a channel disposed radially outward of and beneath a lowermost surface of the annular band; and an outer lip extending upwardly and disposed radially outward of the channel.