PVD Flap System for Homogeneous Coating on Variable Width Substrates

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing PVD processes struggle to achieve homogeneous layer thicknesses on band-shaped substrates, particularly with varying widths, due to high flow resistance and inefficiencies in energy consumption, leading to reduced coating efficiency and increased material waste.

Innovation Solution

A PVD process and device utilizing adjustable flap systems to control gas flow resistance and layer thickness distribution, where flaps act as guide vanes to optimize flow conditions, allowing for adaptable layer thickness across different substrate widths with minimal energy consumption.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If guide vanes are arranged at equal distances to form a screen-like shield, then layer thickness can be adjusted, but homogeneous layer thickness distribution is not achieved and considerable flow resistance is generated

Engineering Contradiction:
Improvelayer thickness distributionVSAvoidenergy consumption
Core Design Contradiction:
Manufacturing precisionVSUse of energy by moving object

Solution Approach 1:

The coating chamber is divided into multiple zones along the substrate width, with independently adjustable guide vanes in each zone. This segmentation allows targeted control of gas flow to different regions, enabling homogeneous layer thickness distribution without requiring all vanes to be positioned at equal distances, thus reducing overall flow resistance and energy consumption.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Each guide vane can be independently adjusted to create locally optimized flow conditions. The vanes are positioned at different distances from the substrate according to the specific coating requirements of each region, allowing precise control of layer thickness distribution while minimizing unnecessary flow resistance and energy waste.

Inventive Principle:
Principle #3Local quality

2Manufacturing precision

If guide vanes are closed to control flow, then layer thickness can be adjusted, but high flow resistance is generated leading to increased energy consumption and particle buildup

Engineering Contradiction:
Improvelayer thickness controlVSAvoidenergy consumption
Core Design Contradiction:
Manufacturing precisionVSLoss of energy

Solution Approach 1:

The guide vanes are designed to be dynamically adjustable during the coating process. By continuously optimizing the vane positions and angles based on real-time coating conditions, the system maintains effective layer thickness control while minimizing flow resistance and energy consumption, avoiding the need to keep vanes in fixed closed positions.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The system changes multiple parameters simultaneously, including vane position, vane angle, and gas flow rate, to achieve the desired layer thickness. This multi-parameter adjustment allows the system to reach the coating target with lower overall flow resistance compared to simply closing vanes, thereby reducing energy consumption and particle buildup.

Inventive Principle:
Principle #35Parameter changes

3Manufacturing precision

If complex mechanical systems are used to mitigate diffuse reflection effects, then coating homogeneity can be improved, but high flow resistances are generated and energy efficiency is reduced

Engineering Contradiction:
Improvecoating homogeneityVSAvoidmechanical system complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent extracts and addresses the diffuse reflection problem specifically through targeted guide vane positioning and angling in affected regions, rather than implementing complex mechanical systems throughout the entire coating apparatus. This localized approach achieves coating homogeneity while keeping the overall system simpler and flow resistance lower.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The guide vanes serve as intermediary elements that mediate between the gas flow and the substrate surface. By carefully positioning and angling these vanes, the system controls gas flow patterns to mitigate diffuse reflection effects and improve coating homogeneity without requiring complex mechanical intervention systems.

Inventive Principle:
Principle #24Intermediary (Mediator)

4Manufacturing precision

If flaps are used to control gas flow, then layer thickness distribution can be optimized, but flow resistance increases leading to reduced productivity

Engineering Contradiction:
Improvelayer thickness distributionVSAvoidcoating efficiency
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The guide vanes are adjusted in a periodic or sequential manner during the coating process, optimizing flow control at different stages. This allows the system to achieve good layer thickness distribution while maintaining higher overall gas flow rates compared to continuous high-resistance flow control, thereby improving coating productivity.

Inventive Principle:
Principle #19Periodic action

Solution Approach 2:

The system combines multiple flow control mechanisms - guide vanes, gas injection points, and chamber geometry - into a composite approach. This composite strategy achieves effective layer thickness distribution with lower overall flow resistance than any single mechanism alone, preserving coating productivity.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables homogeneous layer thickness distribution across band-shaped substrates with reduced flow resistance and energy efficiency, achieving up to ten times less energy consumption compared to electrolytic coating processes, while allowing for flexible adaptation to varying substrate widths and precise control of layer thickness.

Implementation Method 1

A PVD method for depositing metallic layers from a vapor phase onto a substrate

Methodology Applied
Scientific EffectPhysical vapor deposition: Physical Vapour Deposition

Implementation Method 2

at least one flap per substrate side, which flap is arranged so as to be rotatable about an axis of rotation for influencing the flow resistance

Methodology Applied
Scientific EffectGas flow control:

Data Source

PatentEP4200459B1Pvd process and device therefor
Publication Date: 2024.05.01 VOESTALPINE STAHL GMBH
  • EP4200459B1 patent drawingFigure 1
  • EP4200459B1 patent drawingFigure 2
  • EP4200459B1 patent drawingFigure 3

AI summary

The invention relates to a PVD process for depositing metallic layers from a vapour phase onto a metallic substrate, in particular onto substrates with different strip widths, wherein at least one evaporator and a substrate are provided in a coating unit and there is a flow path for the coating particles between the evaporator and the substrate, wherein in the flow path, for each side of the substrate, is provided at least one flap which is arranged pivotably about a pivot axis in order to influence the flow resistance, wherein the pivot axis extends in a plane parallel to the plane of the substrate and preferably longitudinally in relation to the transport direction of the substrate.