Adjustable Ground Shield for PVD Chamber Target Alignment
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Solution Overview
Problem
The alignment of ground shields with targets in physical vapor deposition (PVD) chambers is time-consuming and costly, especially with larger targets, due to the difficulty in maintaining a small gap between the ground shield and the target, which affects the efficiency and uniformity of the PVD process.
Innovation Solution
An adjustable ground shield system is introduced, where the ground shield is insulatively coupled to a ground frame that is attached to the lid assembly, allowing for precise alignment with the target before the lid is installed, and can be adjusted in segments to maintain a uniform gap, eliminating the need for post-installation adjustments and costly precision components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a ground shield is attached directly to the vacuum chamber walls to confine plasma, then plasma confinement is improved, but alignment with the target becomes difficult and time-consuming
Solution Approach 1:
A ground frame is introduced as an intermediary component between the vacuum chamber walls and the ground shield. The ground frame is attached to the chamber walls and provides a standardized mounting structure, while the ground shield attaches to the ground frame. This intermediary allows the ground shield to be easily aligned with the target by aligning it with the ground frame rather than directly with the chamber walls, significantly reducing alignment time while maintaining plasma confinement effectiveness.
2Manufacturing precision
If the ground shield is made adjustable to maintain a small gap with the target, then deposition uniformity is improved, but device complexity increases
Solution Approach 1:
The ground shield is designed with adjustable positioning capabilities that allow it to be dynamically positioned relative to the target. The adjustment mechanism enables the ground shield to be moved to maintain an optimal small gap with the target surface, ensuring uniform plasma distribution and consistent film deposition. This dynamic adjustability is achieved through a relatively simple mechanism that does not significantly increase overall device complexity.
3Productivity
If larger targets are used to process larger substrates, then processing capacity is improved, but alignment difficulty with the ground shield increases
Solution Approach 1:
The ground shield is divided into multiple segmented sections that can be independently adjusted and positioned. This segmentation allows each section to be aligned with the corresponding portion of a large target, making the alignment process more manageable. Instead of aligning one large ground shield with a large target, the segmented design enables step-by-step alignment of smaller sections, significantly easing the operation for large substrate processing while maintaining high productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces setup time and costs, improves the alignment and control of the PVD process, enhances the uniformity of film deposition, and maximizes the efficient use of target materials while minimizing redeposition on chamber components, leading to improved product quality and reduced maintenance.
Implementation Method 1
The ground shield helps confine the plasma within the processing region
Implementation Method 2
ejection of atoms of the target material. The ejected atoms accumulate as a deposited film on a substrate
Data Source
AI summary
Apparatus for processing a substrate in a physical vapor deposition chamber is provided herein. In one embodiment, apparatus for processing a substrate in a physical vapor deposition chamber having a target disposed in a lid assembly and a grounded chamber wall includes a ground frame and a ground shield. The ground frame is configured to be insulatively coupled to the lid assembly and has an electrically conductive lower surface. The ground shield has an electrically conductive wall that is adjustably and electrically coupled to the conductive lower surface of the ground frame. The ground shield is configured to circumscribe the target and has an upper edge configured to provide a gap between the upper edge and a peripheral edge of the target when installed.