Adjustable Magnetron Base Plate Assembly for PVD Chamber Gap Control

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Solution Overview

Problem

The existing magnetron sputtering apparatuses face difficulties in adjusting the size of the target magnetic gap, which is crucial for optimal film formation in semiconductor manufacturing, as the chamber structure does not allow for convenient adjustments.

Innovation Solution

A physical vapor deposition (PVD) chamber design that includes a connection assembly with a bolt head and bolt, allowing for the adjustment of the interval between the base plate assembly and the backplate by rotating the connection assembly, enabling the convenient adjustment of the target magnetic gap according to requirements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the chamber structure is fixed with a rigid connection between base plate assembly and backplate, then structural stability is maintained, but the target magnetic gap cannot be adjusted

Engineering Contradiction:
Improveadjustability of target magnetic gapVSAvoidcomplexity of connection structure
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The connection assembly transforms the fixed rigid connection into a dynamic adjustable connection. The base plate assembly can be moved relative to the backplate along the adjustment direction by rotating the connection assembly, enabling the target magnetic gap to be adjusted according to different process requirements while maintaining structural stability when locked in position.

Inventive Principle:
Principle #15Dynamics

2Ease of operation

If the connection assembly allows easy adjustment of the target magnetic gap, then adaptability is improved, but the structural stability may be compromised

Engineering Contradiction:
Improveease of adjusting target magnetic gapVSAvoidstability of chamber structure
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The connection assembly enables dynamic adjustment through rotation while providing stable positioning when adjusted. The structure allows easy operation for gap adjustment while maintaining structural reliability during the sputtering process through proper mechanical design of the connection mechanism.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The target magnetic gap parameter can be changed by adjusting the position of the base plate assembly relative to the backplate. The connection assembly provides a mechanism to change this spatial parameter easily while maintaining the structural integrity of the chamber.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design allows for efficient adjustment of the target magnetic gap, improving work efficiency and ensuring optimal film formation by allowing for precise control of the magnetic field force, thereby enhancing the utilization of the target and reducing uneven consumption.

Implementation Method 1

The magnetron is arranged close to the target to apply a magnetic field force to atoms that escape from the target to drive the atoms to a predetermined deposition position

Methodology Applied
Scientific EffectMagnetic field force: Magnetic Field

Implementation Method 2

The connection assembly may be connected to a base plate assembly. The connection assembly may be threadedly connected to the backplate. Thus, an interval between the base plate assembly and the backplate may be adjusted by moving the connection assembly relative to the backplate

Methodology Applied
Scientific EffectMechanical adjustment:

Implementation Method 3

The bolt head may be configured as a convex spherical surface. The base plate assembly may include a base plate body. A first groove with a first concave spherical surface may be arranged in the base plate body. The bolt head may be arranged in the first groove. The convex spherical surface may adapt to the concave spherical surface.

Methodology Applied
Scientific EffectSpherical adaptation mechanism:

Data Source

PatentUS11732346B2Physical vapor deposition chamber and physical vapor deposition apparatus
Publication Date: 2023.08.22 BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
  • US11732346B2 patent drawing
  • US11732346B2 patent drawing
  • US11732346B2 patent drawing

AI summary

Embodiments of the present disclosure disclose a physical vapor deposition (PVD) chamber and a PVD apparatus. The PVD chamber includes a chamber body. An upper electrode assembly is arranged in the chamber body. The upper electrode assembly includes a base plate assembly for carrying a magnetron, a backplate arranged at an interval with the base plate assembly, and a connection assembly that connects the base plate assembly to the backplate. The connection assembly is connected to the base plate assembly. The connection assembly is threadedly connected to the backplate, so that the interval between the base plate assembly and the backplate can be adjusted by moving the connection assembly relative to the backplate. The PVD chamber and the PVD apparatus of embodiments of the present disclosure can conveniently adjust a size of a target magnetic gap between the base plate assembly and the target according to requirements or actual conditions.