PVD Marking on Substrate with Compliant Buffer Layer

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Solution Overview

Problem

Physical vapor deposition (PVD) processes on substrates, such as glass, result in residual stresses that can cause cracking due to direct bonding of PVD coatings, compromising the substrate's integrity and resistance to fracture.

Innovation Solution

A compliant intermediate layer, such as silicon dioxide, is deposited between the substrate and the PVD material to act as a buffer, reducing stress transmission and preventing premature fracture.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a PVD coating is deposited directly onto the substrate surface, then the marking is formed and bonded to the substrate, but residual stresses cause cracking and compromise substrate integrity

Engineering Contradiction:

Improvesubstrate integrityVSAvoidresistance to fracture

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

A compliant intermediate layer is deposited between the substrate and the PVD coating layer. This intermediate layer acts as a stress buffer that absorbs residual stresses generated during the PVD process, preventing stress transmission to the substrate and eliminating the cracking problem while maintaining the marking function.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent introduces a layer with different mechanical properties (compliant intermediate layer) between the substrate and PVD coating. This changes the stress distribution parameters and mechanical coupling between layers, allowing the system to accommodate residual stresses without substrate failure.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If a compliant intermediate layer is deposited between the substrate and PVD material, then stress transmission is reduced and substrate integrity is maintained, but the device structure becomes more complex

Engineering Contradiction:

Improvesubstrate integrityVSAvoidlayer structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The compliant intermediate layer is implemented as a thin film deposited on the substrate surface. This thin film approach provides the necessary stress-buffering function while minimizing the additional structural complexity and maintaining a compact device design.

Inventive Principle:

Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The compliant intermediate layer effectively isolates the substrate from residual stresses in the PVD coating, enhancing the substrate's resistance to fracture and maintaining the integrity of the device.

Implementation Method 1

A compliant intermediate layer, such as silicon dioxide, is deposited between the substrate and the PVD material

Methodology Applied

Scientific EffectPhysical vapor deposition: Physical Vapour Deposition

Implementation Method 2

a layer of material deposited on the compliant layer using a PVD process

Methodology Applied

Scientific EffectPhysical vapor deposition: Physical Vapour Deposition

Data Source

PatentUS10773494B2Techniques for marking a substrate using a physical vapor deposition material

Publication Date: 2020.09.15 APPLE INC

AI summary

Techniques, processes and structures are disclosed for providing markings on products, such as electronic devices. For example, the markings can be formed using physical vapor deposition (PVD) processes to deposit a layer of material. The markings or labels may be textual and/or graphic. The markings are deposited on a compliant layer that is disposed on a surface to be marked. The compliant layer is arranged to isolate the surface to be marked from the layer of material deposited using the PVD process.