Non-contact PVD Process Kit Shielding Design
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Solution Overview
Problem
Conventional process kits for semiconductor processing chambers in physical vapor deposition (PVD) chambers are prone to contamination due to contact between the ring and shield, leading to particulate generation and temperature fluctuations, which affect the quality and efficiency of the deposition process.
Innovation Solution
The design of an interleaving deposition ring and ground shield that maintains contact with the substrate support pedestal and chamber walls for temperature control, preventing contact between the ring and shield during operation to minimize contamination and thermal stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional ring and shield designs are used with periodic contact during pedestal movement, then the structure is simple and easy to manufacture, but particulate contamination increases due to contact between components
Solution Approach 1:
The patent extracts and eliminates the contact interface between the cover ring and ground shield by introducing a spacer component. This spacer maintains a permanent gap that prevents the ring and shield from contacting each other during pedestal movement, thereby removing the source of particulate contamination while preserving the essential structural functions.
Solution Approach 2:
The patent introduces a spacer as an intermediary component between the cover ring and ground shield. This spacer acts as a mediator that maintains the necessary spacing and prevents direct contact between the ring and shield, eliminating particle generation while allowing both components to perform their respective functions.
2Device complexity
If conventional unconnected cover ring designs are used, then the device complexity is reduced, but temperature fluctuations increase leading to material stress and flaking
Solution Approach 1:
The patent makes the cover ring multi-functional by connecting it to both the substrate support pedestal and the ground shield through spacers. This connection enables the cover ring to serve both as a structural component defining the processing region and as a temperature-controlled component, preventing thermal stress and material flaking without significantly increasing device complexity.
Solution Approach 2:
The patent merges the thermal management function with the structural function of the cover ring by establishing thermal connection pathways to the temperature-controlled pedestal and ground shield. This integration ensures the cover ring maintains stable temperature while continuing to define the processing region.
3Object-affected harmful factors
If the deposition ring prevents deposition on substrate pedestal perimeter, then the substrate support pedestal is protected from contamination, but the device complexity increases with additional components
Solution Approach 1:
The deposition ring is designed to perform multiple functions simultaneously: it defines the processing region, controls plasma confinement, prevents deposition on the substrate pedestal perimeter, and maintains spacing between components through integrated spacer features. This multi-functionality protects the pedestal from contamination without requiring separate dedicated components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces particulate contamination, enhances process uniformity and repeatability, and extends the service life of chamber components by maintaining predictable temperature control and eliminating particle generation sources.
Implementation Method 1
the interleaving deposition ring and ground shield advantageously are maintained in contact with the substrate support pedestal and chamber walls, thereby promoting excellent and predictable temperature control
Implementation Method 2
PVD is a plasma process performed in a vacuum chamber where a negatively biased target is exposed to a plasma of an inert gas
Implementation Method 3
Bombardment of the target by ions of the inert gas results in ejection of atoms of the target material
Implementation Method 4
The cover ring is generally used to create a labyrinth gap between the deposition ring and ground shield, thereby preventing deposition below the substrate
Data Source
AI summary
A process kit for use in a physical vapor deposition (PVD) chamber, along with a PVD chamber having a non-contact process kit are provided. In one embodiment, a process kit includes a generally cylindrical shield that has a substantially flat cylindrical body, at least one elongated cylindrical ring extending downward from the body, and a mounting portion extending upwards from an upper surface of the body. In another embodiment, a process kit includes a generally cylindrical deposition ring. The deposition ring includes a substantially flat cylindrical body, at least one downwardly extending u-channel coupled to an outer portion of the body, an inner wall extending upward from an upper surface of an inner region of the body, and a substrate support ledge extending radially inward from the inner wall.