Multicathode PVD Chamber Ring Assembly for Particle Defect Reduction

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Physical vapor deposition (PVD) processing chambers face challenges in minimizing particle generation and maintaining flatness of the carrier base, leading to friction and vibrations that result in defects during the manufacture of extreme ultraviolet (EUV) mask blanks.

Innovation Solution

The implementation of a PVD chamber design featuring a rotatable pedestal with an inner and outer deposition ring assembly, which reduces friction by allowing a gap between the carrier base and the deposition rings, and a motor-controlled rotational system with specific RPM and acceleration ranges to minimize particle defects.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If the carrier base is placed on the rotatable pedestal with a gap less than 0.01 inches between the bottom surface of the carrier base and the top surface of the deposition ring, then deposition material is prevented from entering the gap, but friction and vibrations are generated causing particle defects

Engineering Contradiction:
Improveparticle generationVSAvoidflatness of carrier base
Core Design Contradiction:
Object-affected harmful factorsVSManufacturing precision

Solution Approach 1:

The single deposition ring is divided into two separate rings: a first deposition ring adjacent to the pedestal edge and a second deposition ring adjacent to the first deposition ring. This segmentation creates a larger total gap between the carrier base and the deposition ring structure, eliminating friction while maintaining deposition material containment through the bridging configuration of the two rings working together

Inventive Principle:
Principle #1Segmentation

2Object-generated harmful factors

If the gap between the carrier base and deposition ring is increased to reduce friction, then particle generation is reduced, but deposition material may enter the gap causing defects

Engineering Contradiction:
Improvefriction-induced particlesVSAvoiddeposition material containment
Core Design Contradiction:
Object-generated harmful factorsVSReliability

Solution Approach 1:

The first and second deposition rings act as intermediary structures that bridge the gap between the pedestal and the cover ring. These rings work together to contain deposition material while allowing a larger gap that reduces friction, effectively mediating between the conflicting requirements of material containment and friction reduction

Inventive Principle:
Principle #24Intermediary (Mediator)

3Productivity

If the rotational speed and acceleration are increased to improve productivity, then deposition efficiency is improved, but vibrations increase causing reticle position instability

Engineering Contradiction:
Improvedeposition rateVSAvoidreticle position stability
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The system optimizes rotational parameters by controlling the rotatable pedestal to rotate at 10-20 RPM with rotational acceleration between 0.10-15 RPM/second and deceleration between 0.10-0.15 RPM/second. These parameter changes balance deposition efficiency with vibration control, preventing reticle displacement while maintaining productive processing speeds

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design effectively reduces particle defects and maintains substrate flatness, enhancing the quality of EUV mask blanks by minimizing friction and vibrations during the PVD process.

Implementation Method 1

Friction not only causes generation of particles, but the friction also creates vibrations

Methodology Applied
Scientific EffectFriction: Friction

Implementation Method 2

Physical vapor deposition (PVD) is used for the deposition of metals and related materials in the fabrication of semiconductor integrated circuits

Methodology Applied
Scientific EffectPhysical vapor deposition: Physical Vapour Deposition

Data Source

PatentUS12051576B2Multicathode deposition system and methods
Publication Date: 2024.07.30 APPLIED MATERIALS INC
  • US12051576B2 patent drawing
  • US12051576B2 patent drawing
  • US12051576B2 patent drawing

AI summary

A physical vapor deposition (PVD) chamber and a method of operation thereof are disclosed. Chambers and methods are described that provide a chamber comprising a deposition ring assembly comprising an inner and outer deposition ring which reduces particle defects.