Cover and Deposition Ring Roughness Layout for PVD Flake Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In physical vapor deposition (PVD) processes, the accumulation of deposition material on the deposition ring leads to flaking and contamination within the vacuum chamber, disrupting operations due to its rough surface causing easy adhesion and dislodging of material, which contaminates the substrate and processing chamber.
Innovation Solution
A cover ring and deposition ring with smooth surfaces are used to minimize the adhesion and dislodging of deposition material, with the cover ring's bottom surface and deposition ring's top surface having a smooth finish to limit accumulation and flaking, reducing contamination and operational disruptions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a rough surface is used on the deposition ring, then deposition material adheres easily to the ring, but this causes flaking and contamination within the vacuum chamber
Solution Approach 1:
The patent applies different surface roughness to different regions of the deposition ring. Specifically, the inner peripheral surface has a first roughness while the outer peripheral surface has a second roughness that is less than the first roughness. This local differentiation allows the inner region to effectively capture deposition material while the smoother outer region minimizes flaking and contamination, thus resolving the contradiction between adhesion and contamination.
2Quantity of substance
If the substrate support is positioned close to the deposition ring, then deposition material accumulates on the ring, but this leads to operational disruptions due to flaking
Solution Approach 1:
By creating a gradient in surface roughness across the deposition ring (smoother outer region, rougher inner region), the patent enables the system to tolerate higher accumulation of deposition material without suffering from flaking-induced operational disruptions. The smoother outer region acts as a low-flake zone that maintains operational continuity even when material accumulates.
3Object-generated harmful factors
If a smooth surface is used on the cover ring, then flaking is reduced, but deposition material may still accumulate on rough surfaces
Solution Approach 1:
The patent implements a dual-roughness deposition ring where the inner peripheral surface maintains higher roughness to capture and hold deposition material through effective adhesion, while the outer peripheral surface has lower roughness to minimize flaking. This local quality differentiation simultaneously addresses both the need for material accumulation (inner region) and flaking reduction (outer region).
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces the flaking and dispersion of deposition material, maintaining a cleaner processing environment and minimizing operational interruptions in PVD processes.
Implementation Method 1
Physical vapor deposition (PVD), or sputtering, is a process used in the fabrication of electronic devices. PVD is a plasma process performed in a vacuum chamber where a negatively biased target is exposed to a plasma of an inert gas having relatively heavy atoms (e.g., argon (Ar)) or a gas mixture comprising such inert gas. Bombardment of the target by ions of the inert gas results in ejection of atoms of the target material. The ejected atoms accumulate as a deposited film on a substrate placed on a substrate support pedestal disposed within the chamber.
Implementation Method 2
Physical vapor deposition (PVD), or sputtering, is a process used in the fabrication of electronic devices. PVD is a plasma process performed in a vacuum chamber where a negatively biased target is exposed to a plasma of an inert gas having relatively heavy atoms (e.g., argon (Ar)) or a gas mixture comprising such inert gas. Bombardment of the target by ions of the inert gas results in ejection of atoms of the target material.
Data Source
AI summary
An assembly includes a cover ring having a first surface and a second surface opposite the first surface, the first surface of the cover ring having a first roughness, and a deposition ring having a first surface facing the cover ring and a second surface opposite the first surface, the first surface of the deposition ring having a second roughness. The first roughness is different from the second roughness.