PVD Metal Shielded Electrical Connector EMI
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Solution Overview
Problem
Traditional electrical connectors face issues with electromagnetic interference, which affects their ability to effectively connect to mating electrical components, impacting their performance.
Innovation Solution
An electrical connector with an insulating housing and conductive terminals, where a metal layer is applied via physical vapor deposition (PVD) to shield the terminals from electromagnetic interference, and is strategically positioned on the housing and PCB for effective shielding and connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional electrical connectors are used without additional shielding, then the device complexity is low, but electromagnetic interference affects connection effectiveness
Solution Approach 1:
The patent combines the shielding function with the insulating housing by forming a metal layer directly on the housing surface. This integration merges the structural support function of the housing with the electromagnetic shielding function, eliminating the need for separate shielding components and maintaining low device complexity while improving connection effectiveness.
Solution Approach 2:
The patent uses a composite structure combining insulating material (housing) with conductive material (metal layer). This composite approach allows the housing to simultaneously provide mechanical support, electrical insulation, and electromagnetic shielding, resolving the contradiction between reliability improvement and complexity increase.
2Object-affected harmful factors
If a metal layer is added to shield conductive terminals, then electromagnetic interference is reduced, but manufacturing complexity increases
Solution Approach 1:
The metal layer is formed on the insulating housing before the conductive terminals are installed. This preliminary action allows the shielding structure to be prepared in advance, simplifying the overall manufacturing process by eliminating the need for complex assembly steps involving separate shielding components.
Solution Approach 2:
The patent replaces mechanical shielding structures (such as metal shields or cages) with a thin metal layer deposited via physical vapor deposition. This substitution eliminates complex mechanical assembly steps while providing effective electromagnetic interference shielding, significantly improving ease of manufacture.
3Reliability
If physical vapor deposition is used to form the metal layer, then shielding effectiveness is improved, but production time increases
Solution Approach 1:
The patent optimizes the parameters of the physical vapor deposition process, including deposition rate, layer thickness, and deposition temperature, to achieve effective shielding with minimal production time. By carefully controlling these parameters, the process becomes highly efficient while maintaining superior shielding effectiveness.
Solution Approach 2:
The patent applies a thin metal layer that provides sufficient shielding effectiveness without requiring excessive material or prolonged deposition time. The layer thickness is optimized to provide just enough shielding to resolve EMI issues, balancing shielding effectiveness with manufacturing efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively shields conductive terminals from electromagnetic interference, ensuring reliable connection to mating electrical components by reducing interference and enhancing the connector's performance.
Implementation Method 1
The insulating housing has a metal layer for shielding the conductive terminals from electromagnetic interference
Implementation Method 2
the metal layer is formed on the insulating housing via physical vapor deposition (PVD)
Data Source
AI summary
An electrical connector, includes an insulating housing having a plurality of terminal receiving holes, and a plurality of conductive terminals received in the receiving holes respectively. The insulating housing has a metal layer for shielding the conductive terminals from electromagnetic interference, and the metal layer is formed on the insulating housing via physical vapor deposition (PVD). In contrast to traditional methods, the electrical connector of the present invention connects to a mating electrical component effectively.

