PVD Target Structure With Embedded Spacer for Deposition Uniformity
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Solution Overview
Problem
Semiconductor fabrication faces challenges in achieving deposition uniformity as dimension scaling becomes increasingly difficult, particularly in advanced technology nodes, where stringent layer deposition specifications and reduced layer thicknesses complicate the process, and target uniformity in physical vapor deposition (PVD) apparatuses is critical for improving deposition uniformity.
Innovation Solution
A deposition apparatus with a target structure that includes an adhesion layer foundation on the base plate and an embedded spacer within the adhesion layer, which reduces waviness and improves the uniformity of the adhesion layer, thereby enhancing the uniformity of the deposition material layer formed on semiconductor wafers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If dimension scaling is pursued to increase functional density, then production efficiency increases and costs decrease, but manufacturing complexity increases and deposition uniformity becomes harder to achieve
Solution Approach 1:
The patent introduces an intermediary structure (the adhesion layer with embedded spacer) between the target and the substrate to mediate the deposition process. The spacer acts as a mediator that transmits mechanical force uniformly across the adhesion layer, preventing waviness and ensuring uniform material deposition even at scaled dimensions where deposition uniformity is critical
Solution Approach 2:
The patent changes the physical parameters of the target structure by embedding a rigid spacer within the adhesion layer. This modifies the mechanical properties (stiffness, stress distribution) of the adhesion layer, transforming it from a potentially wavy, non-uniform layer to a flat, uniform layer that enables consistent deposition across the substrate surface
2Strength
If adhesion layer thickness is increased to improve bonding, then bonding strength increases, but layer waviness increases and deposition uniformity deteriorates
Solution Approach 1:
The patent applies local quality by embedding the spacer only in specific critical regions of the adhesion layer where waviness occurs, rather than uniformly throughout. The spacer provides localized mechanical support precisely where needed to maintain flatness, while allowing the adhesion layer to maintain its bonding function in other regions
Solution Approach 2:
The patent creates a composite structure by combining the adhesion layer material with an embedded spacer material of different mechanical properties. This composite adhesion layer structure leverages the bonding capability of the adhesion layer material and the structural rigidity of the spacer material to simultaneously achieve strong bonding and flat surface
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The improved target structure leads to better deposition uniformity, increased thermal conductivity, and reduced shear stress, resulting in enhanced film yield and processing efficiency.
Implementation Method 1
an adhesion structure in physical contact with the backplane structure and the target
Implementation Method 2
target uniformity in physical vapor deposition (PVD) apparatuses is critical for improving deposition uniformity
Data Source
AI summary
A deposition apparatus includes a process chamber, a wafer support in the process chamber, a backplane structure having a first surface in the process chamber facing the wafer support, a target having a second surface facing the first surface and a third surface facing the wafer support, and an adhesion structure in physical contact with the backplane structure and the target. The adhesion structure has an adhesion material layer, and a spacer embedded in the adhesion material layer.