PVDC Tie Layer Materials for Retort Sterilization

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Solution Overview

Problem

Existing tie layer materials for poly(vinylidene chloride) (PVDC) in co-extruded film structures, such as EVA, EMA, and EAA, are not suitable for retort applications due to their low melting points and inability to withstand heat sterilization temperatures above 121° C.

Innovation Solution

The use of polyether polyester copolymers, polyurethanes with melting temperatures above 121° C, and blends of polyamides with ethylene copolymers containing amine reactive functional groups as tie layers, which provide improved heat resistance and bonding capabilities with PVDC layers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If traditional tie layer materials (EVA, EMA, EAA) are used with PVDC, then bonding capability is achieved, but heat resistance is insufficient for retort applications

Engineering Contradiction:
Improvebonding capabilityVSAvoidheat resistance
Core Design Contradiction:
StrengthVSTemperature

Solution Approach 1:

The patent changes the key parameter of tie layer melting temperature from below 121°C to above 121°C by selecting specific polymer materials (polyethylene copolymers with amine reactive groups, polyamides, polyester polymers) that maintain PVDC bonding capability while withstanding retort sterilization temperatures

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent uses composite tie layer structures combining multiple polymer components (e.g., polyethylene copolymer with amine reactive groups and polyamide, or polyester polymer blends) to achieve both PVDC bonding affinity and high temperature stability required for retort applications

Inventive Principle:
Principle #40Composite materials

2Ease of manufacture

If tie layer materials with low melting points are used, then ease of manufacture is improved, but reliability during steam sterilization deteriorates

Engineering Contradiction:
Improveprocessing easeVSAvoidsterilization resistance
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent raises the melting temperature parameter of the tie layer material above 121°C while maintaining processability through selection of specific polymers (polyethylene copolymers, polyamides, polyester polymers) that offer an optimal balance between manufacturing ease and sterilization reliability

Inventive Principle:
Principle #35Parameter changes

3Strength

If miscibility-based bonding is used between tie layer and PVDC, then bonding strength is achieved, but heat sterilization resistance is lost

Engineering Contradiction:
Improvebonding strengthVSAvoidsterilization resistance
Core Design Contradiction:
StrengthVSTemperature

Solution Approach 1:

The patent employs composite tie layer materials combining polyester polymers with polyethylene copolymers or polyamides, where the polyester component provides heat sterilization resistance while the other components ensure bonding strength through miscibility and chemical reactivity with PVDC

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent assigns different functional properties to different components within the tie layer: one component (e.g., polyester polymer) provides high temperature stability while another component (e.g., polyethylene copolymer with amine reactive groups) provides bonding capability, creating local specialization within the tie layer structure

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The proposed solution enables the creation of multiple layer structures that can withstand moist heat sterilization, ensuring the integrity and functionality of PVDC-based films and containers, particularly in retortable packaging applications.

Implementation Method 1

the tie layer material should be resistant to heat sterilization, for example, at temperatures greater than about 121° C. Tie layer materials such as EVA, EMA and EAA all have melt points below 121° C. and are not able to resist mechanical deformation during steam sterilization

Methodology Applied
Scientific EffectThermal resistance:

Implementation Method 2

A good tie layer usually needs to have some miscibility with the substrate to create entanglement at the interface, or have chemical reactivity with the substrate to create chemical bonds

Methodology Applied
Scientific EffectChemical bonding: Chemical Bonding

Data Source

PatentUS8043680B2Multiple layer structures comprising a poly (vinylidene chloride) layer
Publication Date: 2011.10.25 VANTIVE HEALTH GMBH
  • US8043680B2 patent drawing
  • US8043680B2 patent drawing
  • US8043680B2 patent drawing

AI summary

Multiple layer structures comprising one or more poly(vinylidene chloride) layers and containers made from the multiple layer structures are provided. In a general embodiment, the present disclosure provides a multiple layer structure comprising one or more PVDC layers comprising a component selected from the group consisting of a poly(vinylidene chloride), a poly(vinylidene chloride) copolymer, and combinations thereof. The multiple layer structure further comprises one or more tie layers attached to the PVDC layer. The tie layer comprises a component selected from the group consisting of (a) polyether polyester copolymers, (b) polyurethanes having a melting temperature above about 121° C., (c) a blend comprising a polyamide and an ethylene copolymer containing an amine reactive functional group, and combinations thereof.