PVDF Annular Array Transducer Fabrication via Ball-Bearing Compression
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Solution Overview
Problem
High-frequency ultrasound imaging is limited by the small depth of field and high two-way insertion loss of single element transducers, which restricts image resolution and depth of field, and existing methods struggle to fabricate high-frequency annular array transducers due to material limitations and complexity.
Innovation Solution
A high-frequency ultrasound annular array transducer is fabricated using a polyvinylidene fluoride (PVDF) film bonded with a copperclad polyimide film and epoxy, formed into a concave shape using a ball-bearing compression method, allowing for improved acoustic impedance matching and electronic focusing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If single element focused transducers are used for HFU applications, then fabrication is simple, but depth of field is limited and image resolution is restricted to a small axial range
Solution Approach 1:
The transducer is divided into multiple independent annular elements that can be individually controlled. This segmentation allows electronic focusing and imaging across a larger depth of field while maintaining fabrication simplicity through modular construction using standard PVDF materials and techniques.
Solution Approach 2:
The invention transitions from a single-element design to a multi-element annular array configuration. This dimensional change from one element to multiple concentric rings enables electronic beam forming and focusing capabilities that extend the depth of field while preserving the simplicity of PVDF-based fabrication.
2Ease of manufacture
If PVDF membranes are used as the active acoustic layer, then fabrication is simple, but two-way insertion loss is high (≈40 dB)
Solution Approach 1:
The invention optimizes PVDF transducer performance by changing key parameters including increasing piezoelectric coefficients through material composition adjustments, optimizing thickness ratios between PVDF layers and backing materials, and tuning electrical matching networks to compensate for the inherent high insertion loss of PVDF while maintaining fabrication simplicity.
Solution Approach 2:
The transducer employs composite material structures combining PVDF with optimized backing layers, matching layers, and electrode configurations. These composite designs improve acoustic impedance matching and reduce insertion loss while preserving the ease of PVDF-based fabrication processes.
3Loss of energy
If ceramic materials are used for HFU transducers, then insertion loss is reduced, but fabricating curved shapes is difficult
Solution Approach 1:
The invention changes the material parameter from ceramic to PVDF, which inherently possesses the flexibility to be formed into curved shapes through simple bending and bonding processes. This material substitution maintains low insertion loss through optimized PVDF composition and structure while dramatically improving ease of manufacturing curved transducer geometries.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a transducer with enhanced axial resolution, reduced lateral beamwidth, and improved depth of field, enabling two-dimensional imaging with a limited number of elements and reduced insertion loss, while maintaining the advantages of PVDF materials in acoustic impedance matching.
Implementation Method 1
a PVDF film on the epoxy... The assembly of materials are then pressed to bond the polyvinylidene fluoride film to the copperclad polyimide film
Implementation Method 2
depositing a copperclad polyimide film... The area behind the copperclad polyimide film surface is filled with a second epoxy
Implementation Method 3
bonded with a copperclad polyimide film and epoxy, formed into a concave shape... allowing for improved acoustic impedance matching
Data Source
AI summary
Techniques for fabricating high frequency ultrasound transducers are provided herein. In one embodiment, the fabrication includes depositing a copperclad polyimide film, a layer of epoxy on the copperclad polyimide film, and a polyvinylidene fluoride film on the epoxy. The assembly of materials are then pressed to bond the polyvinylidene fluoride film to the copperclad polyimide film and to form an assembly. The polyvinylidene fluoride film being one surface and the copperclad polyimide film being the other surface. The area behind the copperclad polyimide film surface is filled with a second epoxy, and then cured to form an epoxy plug.


