Printed Wiring Board Sheet Cutting After Defect Screening
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Solution Overview
Problem
Existing methods for manufacturing printed wiring boards fail to efficiently separate non-defective products from defective ones, leading to mixing and reduced manufacturing efficiency.
Innovation Solution
A method involving electrical inspection to determine non-defective products, followed by selective cutting and appearance inspection, with data passing and laser-based marking and cutting to ensure only non-defective products are processed, using jigs and devices to manage the process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If all printed wiring board pieces are cut out from the sheet, then manufacturing efficiency is improved, but defective products are mixed with non-defective products
Solution Approach 1:
The patent performs electrical inspection on all printed wiring board pieces before cutting, and pre-marks defective products with laser. This preliminary classification action enables subsequent selective cutting to efficiently separate non-defective products while maintaining high productivity.
Solution Approach 2:
The patent extracts and removes defective products from the printed wiring board sheet through selective cutting based on inspection results. By taking out only non-defective products for further processing and leaving defective ones on the sheet, it achieves both high efficiency and reliable product separation.
2Reliability
If electrical inspection is performed on all pieces, then product quality is improved, but processing time increases
Solution Approach 1:
The patent performs electrical inspection continuously on all printed wiring board pieces while they remain on the sheet, without interruption or separation. This continuous inspection process determines the quality status of each piece efficiently, improving product quality determination while minimizing processing time through uninterrupted operation.
3Device complexity
If defective products are not marked, then processing is simpler, but defective products cannot be identified for separation
Solution Approach 1:
The patent uses laser marking to create visible marks on defective printed wiring board pieces. This color/visual change provides clear identification of defective products, enabling reliable separation while maintaining relatively simple processing through direct laser marking without complex labeling systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances manufacturing efficiency by preventing defective products from being mixed with non-defective ones, reducing losses, and improving overall production quality.
Implementation Method 1
a laser beam for cutting out the non-defective product
Implementation Method 2
determining, by an electrical inspection, whether each of the plurality of printed wiring board pieces is a non-defective product or a defective product
Data Source
AI summary
A method of manufacturing a printed wiring board according to one aspect of the present disclosure is a method of manufacturing a printed wiring board from a printed wiring board sheet having a plurality of printed wiring board pieces. The method includes: determining, by an electrical inspection, whether each of the plurality of printed wiring board pieces is a non-defective product or a defective product; after the determining, selectively cutting out the non-defective product from the printed wiring board sheet; and inspecting an appearance of the non-defective product cut out in the cutting out. The method further includes passing on data about a non-defective product or a defective product to the cutting out, the data about a non-defective product or a defective product being obtained in the determining. In the cutting out, the non-defective product is cut out based on the data passed on in the passing on.