Printed Wiring Board Layer Segmentation for Design Efficiency
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The design of printed wiring boards for electronic circuits is often labor-intensive and time-consuming due to a lack of commonality and versatility, requiring separate design for each specific application, which hinders efficient production and modification.
Innovation Solution
A printed wiring board design that separates circuit blocks into specific design blocks for individual applications on one outer layer and common design blocks for shared functions on another outer layer, allowing for standardized wiring patterns on the inner layers to reduce design time and labor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If separate design is performed for each electronic circuit specification, then the circuit can be customized for specific applications, but design time and labor increase significantly
Solution Approach 1:
The printed wiring board is divided into multiple layers with distinct functions: outer layers (first and second outer surfaces) are designated for specific design circuit blocks tailored to application requirements, while inner layers are designated for common design circuit blocks that remain standardized across different applications. This segmentation allows customization at the application interface while maintaining standardized core functionality, significantly reducing design time without sacrificing adaptability.
2Adaptability or versatility
If the entire printed wiring board is redesigned for each specification, then all circuit requirements are met, but design complexity and effort multiply
Solution Approach 1:
The design is segmented into customizable outer layers and standardized inner layers, reducing overall design complexity while maintaining specification compliance.
Solution Approach 2:
The inner layers are designed with universal common design circuit blocks that can be reused across different specifications and applications. These standardized layers provide consistent functionality (such as power distribution, grounding, or signal routing) that is common to most electronic circuits, eliminating the need to redesign these portions for each new application.
3Productivity
If common design patterns are reused across different specifications, then design efficiency improves, but specific application requirements may not be fully met
Solution Approach 1:
The board is segmented into inner layers for common design patterns and outer layers for application-specific customization, resolving the contradiction between efficiency and adaptability.
Solution Approach 2:
Different layers of the printed wiring board are assigned different design qualities: inner layers use standardized common design patterns for efficiency, while outer layers allow customized specific design patterns to meet application-specific requirements. This local differentiation of design quality enables both high productivity through reuse and full adaptability to specific applications.
Data Source
AI summary
A printed wiring board includes a first outer surface, a second outer surface, and an electronic circuit. The second outer surface is opposite to the first outer surface. The electronic circuit includes at least one specific design circuit block and at least one common design circuit block. The at least one specific design circuit block is provided on the first outer surface and designed in accordance with a specification of a device to which the printed wiring board is applied. The at least one common design circuit block is for a common use regardless of the specification of the device. The at least one common design circuit block is provided on the second outer surface.