Printed Wiring Board Segmented Substrate Warping Reduction

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Solution Overview

Problem

Existing printed wiring boards face challenges in minimizing warping and stress on electronic components due to large accommodation sections, which can lead to reduced connection reliability and increased risk of electronic component damage, especially when multiple components are integrated.

Innovation Solution

A printed wiring board design featuring a substrate with partially connected multiple opening portions to accommodate electronic components, secured with filler resin and a resin insulation layer, along with conductive layers and via conductors to enhance connection reliability and reduce warping.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If large accommodation sections are used to accommodate multiple electronic components, then the components can be integrated, but warping and stress on components increase

Engineering Contradiction:

Improvecomponent integrationVSAvoidwarping

Core Design Contradiction:

Adaptability or versatilityVSStability of the object's composition

Solution Approach 1:

The accommodation section is divided into multiple separate opening portions rather than using a single large space. Each opening portion accommodates individual electronic components, which segments the overall structure and reduces warping while maintaining component integration capability.

Inventive Principle:

Principle #1Segmentation

2Adaptability or versatility

If large accommodation sections are used to accommodate multiple electronic components, then the components can be integrated, but stress on electronic components increases

Engineering Contradiction:

Improvecomponent integrationVSAvoidstress on electronic components

Core Design Contradiction:

Adaptability or versatilityVSStress or pressure

Solution Approach 1:

By segmenting the accommodation section into multiple separate opening portions, each component experiences reduced stress concentration. The filler resin provides individual support to each component within its own opening portion, preventing excessive stress accumulation.

Inventive Principle:

Principle #1Segmentation

3Quantity of substance

If multiple electronic components are integrated in a single accommodation section, then component density increases, but connection reliability decreases

Engineering Contradiction:

Improvecomponent densityVSAvoidconnection reliability

Core Design Contradiction:

Quantity of substanceVSReliability

Solution Approach 1:

The single accommodation section is segmented into multiple separate opening portions, each housing individual components. This segmentation allows for dedicated via conductors connecting to each component, improving connection reliability while maintaining high component density through efficient space utilization.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The filler resin acts as an intermediary material that provides mechanical support and electrical insulation between components and the substrate. This intermediary structure enables reliable connections by stabilizing the component positions and providing consistent electrical pathways through the via conductors.

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS8957320B2Printed wiring board

Publication Date: 2015.02.17 IBIDEN CO LTD

AI summary

A printed wiring board includes a substrate having an accommodation section having multiple opening portions, multiple electronic components accommodated in the opening portions, respectively, a filler resin provided in the opening portions in the substrate such that the electronic components are secured in the opening portions in the substrate, a resin insulation layer formed over the substrate and the electronic components, a conductive layer formed on the resin insulation layer, and via conductors formed in the resin insulation layer and connecting the conductive layer and the electronic components. The opening portions are connected to each other.