PWB Temperature Sensor Matrix for Thermal Imaging
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Solution Overview
Problem
Current methods for measuring temperature on printed wiring boards (PWBs) are limited to spot measurements with external sensors, failing to detect hot spots when obstructions like covers or heat sinks block direct thermal imaging, leading to suboptimal temperature profiles and reduced component lifespan.
Innovation Solution
Integration of a temperature sensor matrix within the PWB layers using printed electronics, allowing for comprehensive temperature measurement across multiple points and enabling the creation of thermal images even when obstructions are present.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If external temperature sensors are used for spot measurements, then the measurement device is simple, but the measurement precision and coverage are insufficient
Solution Approach 1:
The temperature sensing function is segmented into multiple discrete sensor elements arranged in a matrix pattern across the PWB. Each sensor element independently measures temperature at its specific location, transforming a single-point measurement system into a distributed multi-point measurement system. This segmentation enables comprehensive thermal mapping while maintaining the simplicity of individual sensor elements.
Solution Approach 2:
The temperature measurement capability is extended from one-dimensional spot measurements to two-dimensional thermal mapping by arranging sensor elements in a matrix pattern across the PWB surface. This dimensional transition enables the system to capture spatial temperature distribution patterns and identify hot spots that would be invisible to conventional point measurements.
2Loss of information
If thermal imaging is performed with obstructions present, then complete thermal data can be obtained, but the measurement becomes more difficult when line of sight is blocked
Solution Approach 1:
The PWB structure itself serves as an intermediary medium, embedding temperature sensor elements within its layers. This internal placement allows the sensors to measure temperature directly at the source without requiring external line of sight. The PWB acts as both the object being measured and the carrier of the measurement instruments, eliminating the need for unobstructed thermal imaging paths.
Solution Approach 2:
Instead of placing sensors outside the PWB and imaging through obstructions, the sensor elements are invertedly placed inside the PWB layers. This inversion transforms the measurement approach from external observation to internal measurement, allowing complete thermal data acquisition regardless of external obstructions such as covers or heat sinks.
3Productivity
If components operate at higher temperatures, then performance may be improved, but the reliability and lifespan decrease dramatically
Solution Approach 1:
The temperature sensor matrix provides real-time feedback on the thermal state of the PWB and its components. This feedback information can be used to monitor temperature trends, detect hot spots, and trigger cooling actions or performance throttling before critical temperature thresholds are exceeded. The continuous thermal monitoring enables proactive thermal management that balances performance optimization with reliability preservation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach provides detailed thermal imaging and improved thermal design quality by enabling thousands of measurement points, ensuring components operate within their optimal temperature ranges and reducing the risk of overheating-related failures.
Implementation Method 1
the temperature sensor matrix comprising multiple temperature sensors arrayed over at least part of area occupied by the at least one of the layers
Data Source
AI summary
An apparatus includes a printed wiring board including multiple layers including inner and outer layers. At least one of the inner layers includes an integral temperature sensor matrix. The temperature sensor matrix includes multiple temperature sensors arrayed over at least part of area occupied by the at least one of the layers. A method includes measuring information corresponding to temperatures in the temperature sensor matrix, and outputting indications of the information. The information may be displayed, e.g., as a thermal image of the printed wiring board.