Pyridinium Compound Plating Bath for Void-Free Copper Filling
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Solution Overview
Problem
Conventional copper plating baths used in the electronics and semiconductor industries fail to achieve complete and void-free filling of recessed structures, such as blind micro vias and through silicon vias, with minimal overburden and dimples, which is crucial for advanced printed circuit board and IC substrate manufacturing.
Innovation Solution
A pyridinium compound is introduced into the copper plating bath, which facilitates uniform and complete copper deposition with minimal organic impurities and defects, using a specific synthesis method that ensures reproducible results and enhanced levelling properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional additives (levelers, carrier-suppressors, accelerator-brighteners) are used in copper plating baths, then copper deposition can be achieved, but complete and void-free filling of recessed structures cannot be achieved with minimal overburden and dimples
Solution Approach 1:
The patent introduces a novel polymeric levelel with specific molecular weight range (1,000 to 100,000 g/mol) and specific functional group compositions (quarternary ammonium groups, pyridinium groups, carboxylic acid groups) to change the chemical parameters of the plating bath. This resolves the contradiction by enabling complete void-free filling while maintaining minimal overburden and dimples, achieving both manufacturing precision and reliability
Solution Approach 2:
The patent uses a composite polymeric levelel containing multiple functional groups (quarternary ammonium, pyridinium, carboxylic acid) within a specific molecular weight range. This composite structure with multiple active sites enables simultaneous achievement of complete recessed structure filling, void elimination, and minimal overburden, resolving the technical contradiction between filling quality and reliability
2Productivity
If conventional plating additives are used, then copper deposition occurs, but the deposit contains organic impurities and defects
Solution Approach 1:
The patent changes the chemical parameters by introducing a polymeric levelel with specific functional groups (quarternary ammonium, pyridinium, carboxylic acid) and molecular weight (1,000 to 100,000 g/mol). This resolves the contradiction by enabling high deposition rates while producing pure, defect-free copper deposits suitable for advanced semiconductor applications
Solution Approach 2:
The polymeric levelel acts as an intermediary substance that mediates between the copper ions and the substrate surface. Its specific functional groups facilitate controlled copper deposition, enabling high productivity while ensuring manufacturing precision through pure and defect-free deposit quality
3Manufacturing precision
If conventional levelers are used in acidic copper plating baths, then some levelling effect is achieved, but current and future requirements for advanced printed circuit boards, IC substrates, and semiconductor metallization cannot be fulfilled
Solution Approach 1:
The patent introduces a polymeric levelel with specific molecular weight (1,000 to 100,000 g/mol) and specific functional group compositions (quarternary ammonium, pyridinium, carboxylic acid groups) to change the chemical parameters of the plating bath. This resolves the contradiction by achieving uniform copper deposition while meeting current and future requirements for advanced applications including TSV filling, dual damascene plating, and through glass via metallization
Solution Approach 2:
The polymeric levelel with multiple functional groups (quarternary ammonium, pyridinium, carboxylic acid) and specific molecular weight range serves multiple functions simultaneously: it provides levelling, enables complete filling of recessed structures, eliminates voids, and ensures uniform deposition. This multi-functionality resolves the contradiction between manufacturing precision and adaptability to various advanced applications
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The pyridinium compound enables smooth, even, and defect-free copper deposits with minimal voids and overburden, improving conductivity and yield in semiconductor applications by ensuring complete filling of recessed structures without significant organic impurities.
Implementation Method 1
electrolytic copper deposition as this is fast and cost-efficient
Implementation Method 2
filling of recessed structures such as through silicon vias (TSV) and dual damascene plating or forming redistribution layers (RDL) and pillar bumps in and on semiconducting substrates
Data Source
AI summary
The present invention concerns pyridinium compounds, a synthesis method for their preparation, metal or metal alloy plating baths containing said pyridinium compounds and a method for use of said metal or metal alloy plating baths.The plating baths are particularly suitable for use in filling of recessed structures in the electronics and semiconductor industry including dual damascene applications.