Pyrochlore Chamber Coating for Fluorination-Resistant Plasma Surfaces

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Solution Overview

Problem

Existing plasma chamber coatings, such as alumina and yttria, fail to provide adequate etch resistance and are susceptible to fluorination reactions, leading to surface degradation and particle contamination, which complicates meeting the requirements for reduced contaminants in next-generation semiconductor manufacturing.

Innovation Solution

A pyrochlore coating, comprising zirconium and hafnium with lanthanum, samarium, yttrium, erbium, cerium, gadolinium, ytterbium, or neodymium, is applied to the plasma-facing surfaces of chamber components, offering enhanced etch resistance and resistance to ion bombardment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If high purity yttria coating is used, then sputter resistance is improved, but manufacturing cost increases due to material cost and processing costs

Engineering Contradiction:

Improvesputter resistanceVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent modifies the material composition parameters by using pyrochlore structure materials with specific stoichiometric ratios that achieve high sputter resistance comparable to or exceeding yttria, while using more cost-effective raw materials and processing routes.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention replaces expensive high-purity yttria with more economical pyrochlore-based coatings that provide equivalent or superior performance. The pyrochlore materials offer comparable durability and protection, effectively substituting a costly material with a more affordable alternative without sacrificing reliability.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

2Reliability

If yttria coating is used, then sputter resistance is improved, but susceptibility to spontaneous fluorination reaction increases

Engineering Contradiction:

Improvesputter resistanceVSAvoidfluorination reaction susceptibility

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent changes the chemical composition parameters by selecting pyrochlore materials with specific elemental combinations (Hf-Zr-La-O system) that inherently resist fluorination reactions. The controlled oxygen content and cation ratios in the pyrochlore structure create chemical stability that prevents spontaneous fluorination while maintaining sputter resistance.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention addresses the fluorination issue by using pyrochlore materials whose crystal structure and chemical composition inherently resist fluorine attack. The complex oxide structure with multiple cations creates a more stable surface that converts the potential harm of fluorine exposure into an opportunity for enhanced chemical stability and reduced particle generation.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Reliability

If existing coatings are used, then basic surface protection is provided, but particle contamination occurs due to surface degradation

Engineering Contradiction:

Improvesurface protectionVSAvoidparticle contamination

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent employs composite pyrochlore coatings with multiple elements that work synergistically to provide robust surface protection. The composite structure resists degradation mechanisms that lead to particle generation, maintaining surface integrity and reducing contamination during plasma processing operations.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

By changing the material parameters to pyrochlore structure with specific compositional ratios, the coating achieves enhanced stability and resistance to plasma-induced degradation. This parameter change reduces surface erosion and particle generation while maintaining effective surface protection.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The pyrochlore coating provides improved etch resistance and reduces surface damage, minimizing particle contamination and ensuring compliance with stringent cleanliness standards in semiconductor manufacturing processes.

Implementation Method 1

offering enhanced etch resistance and resistance to ion bombardment

Methodology Applied

Scientific EffectIon bombardment resistance:

Implementation Method 2

provides improved etch resistance

Methodology Applied

Scientific EffectPlasma etching resistance:

Implementation Method 3

reduces surface damage, minimizing particle contamination

Methodology Applied

Scientific EffectSurface damage resistance:

Data Source

PatentUS20260088260A1Pyrochlore component for plasma processing chamber

Publication Date: 2026.03.26 LAM RES CORP

AI summary

A component for use in a plasma processing chamber system is provided. A component body has a plasma facing surface. The plasma facing surface comprises a pyrochlore, comprising at least one of zirconium and hafnium and at least one of lanthanum (La), samarium (Sm), yttrium (Y), erbium (Er), cerium (Ce), gadolinium (Gd), ytterbium (Yb), and neodymium (Nd).