Pyroelectric Interconnect Cooling for 3D PMIC Hot Spots
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Solution Overview
Problem
Heat dissipation in power management integrated circuits (PMICs) is exacerbated by 3D packaging and becomes increasingly difficult as devices are made more compact, necessitating improved thermal management solutions.
Innovation Solution
Integration of pyroelectric layers between electrodes in metal layer-pyroelectric layer-metal layer (MPM) structures within metallization layers above or below PMICs, utilizing the electrocaloric effect to enhance heat dissipation by cycling electric fields across these layers, which are coupled to a heat sink through vias and metal layers for efficient heat transport.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If 3D packaging is used to integrate PMICs, then device compactness and integration are improved, but heat dissipation becomes more difficult
Solution Approach 1:
A pyroelectric layer is introduced as an intermediary substance between metal layers in the 3D packaged PMIC. This pyroelectric material converts electrical energy to thermal energy through the pyroelectric effect, acting as a mediator that transforms waste electrical energy into useful heat for thermal management, thereby resolving the heat dissipation difficulty caused by compact 3D packaging
Solution Approach 2:
The patent changes the thermal parameters of the 3D packaged device by incorporating pyroelectric layers that can dynamically adjust their thermal properties. By applying electrical fields to the pyroelectric layers, their temperature and thermal conductivity can be modulated, enabling active thermal management in the compact 3D structure
2Area of moving object
If device size is reduced for compactness, then integration density is improved, but thermal management becomes more challenging
Solution Approach 1:
The patent applies local quality by placing pyroelectric layers specifically in regions where thermal management is needed within the 3D packaged PMIC. Rather than uniformly treating the entire device, the pyroelectric materials are strategically positioned between metal layers adjacent to heat-generating components, providing localized thermal control that maintains high integration density while addressing thermal challenges
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The MPM structures effectively increase and decrease the temperature of pyroelectric layers, enhancing heat dissipation from PMICs by cyclically applying electric fields, thereby improving thermal management in compact 3D packaged devices.
Implementation Method 1
The pyroelectric layers are between a first pair of metallization layers... cycling electric fields across these layers, which are coupled to a heat sink through vias and metal layers for efficient heat transport
Implementation Method 2
coupled to a heat sink through vias and metal layers for efficient heat transport
Data Source
AI summary
An electrocaloric heat dissipation device is formed by inserting metal layer-pyroelectric layer-metal layer (MPM) structures between the metallization layers in a metal interconnect. Electric fields are alternately applied and relaxed to induce temperatures of the pyroelectric layers to cycle and drive heat transfer. The heat dissipation device may be placed adjacent a hot spot in a power management integrated circuit (PMIC) and is particularly useful when the PMIC is in a 3D package. In some embodiments, the MPM structures are inserted around circuit wiring. Interconnects for the heat dissipation device may replace dummy metal wiring.