Pyroelectric Interconnect Cooling for 3D PMIC Hot Spots
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Heat dissipation in power management integrated circuits (PMICs) is challenging, especially in compact 3D packaging configurations, where traditional methods struggle to effectively manage increasing thermal loads.
Innovation Solution
Incorporating pyroelectric layers between metal layers in a metal interconnect structure, which utilize the electrocaloric effect to cyclically change temperatures and enhance heat dissipation by applying and removing electric fields, while maintaining electrical isolation through the use of metal electrodes and vias for efficient heat transport to a heat sink.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional heat dissipation methods are used in 3D packaged PMICs, then the device structure is simple and manufacturing is easy, but heat dissipation effectiveness deteriorates as devices become more compact
Solution Approach 1:
The patent employs pyroelectric materials with specific thermoelectric properties integrated into the heat dissipation device. These composite materials exhibit enhanced thermal management capabilities by converting heat directly into electrical energy, thereby improving heat dissipation effectiveness while managing the complexity through targeted material selection and integration into existing 3D package structures.
2Volume of moving object
If device compactness is increased for modern electronic devices, then device integration density improves, but heat dissipation becomes more difficult to resolve
Solution Approach 1:
The patent utilizes materials with specific thermoelectric parameters (high Seebeck coefficient, appropriate electrical conductivity, and thermal conductivity) to enable effective heat dissipation in compact devices. By carefully selecting and optimizing these material parameters, the system achieves superior heat management performance within reduced device volumes, converting thermal energy into electrical energy through the thermoelectric effect.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly enhances heat dissipation from PMICs by leveraging the electrocaloric effect to efficiently transfer heat away from the semiconductor substrate, effectively addressing the thermal management challenges in compact 3D packaging.
Implementation Method 1
Incorporating pyroelectric layers between metal layers in a metal interconnect structure, which utilize the electrocaloric effect to cyclically change temperatures and enhance heat dissipation by applying and removing electric fields
Implementation Method 2
efficiently transfer heat away from the semiconductor substrate, effectively addressing the thermal management challenges in compact 3D packaging
Data Source
AI summary
An electrocaloric heat dissipation device is formed by inserting metal layer-pyroelectric layer-metal layer (MPM) structures between the metallization layers in a metal interconnect. Electric fields are alternately applied and relaxed to induce temperatures of the pyroelectric layers to cycle and drive heat transfer. The heat dissipation device may be placed adjacent a hot spot in a power management integrated circuit (PMIC) and is particularly useful when the PMIC is in a 3D package. In some embodiments, the MPM structures are inserted around circuit wiring. Interconnects for the heat dissipation device may replace dummy metal wiring.