Pyrolytic Adhesive for Micro-LED Oxidation Protection
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Solution Overview
Problem
Micro-LED display panels face reliability issues due to oxidation of welding points between micro-LED chips and bonding pads, leading to increased power consumption and potential chip failure, especially in water and oxygen conditions.
Innovation Solution
A temporary chip assembly is created with a pyrolytic adhesive layer on a substrate, where micro light-emitting chips are embedded with electrodes, allowing the pyrolytic adhesive to separate and remain between the electrodes, flowing to cover welding points when transferred, thus blocking water and oxygen and preventing oxidation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If strong metal activeness bonding pads (indium) are used to bond micro-LED chips, then bonding strength is improved, but welding points are easy to oxidize in water and oxygen conditions, leading to increased resistance and power consumption
Solution Approach 1:
A pyrolytic adhesive layer is introduced as an intermediary between the micro-LED chip electrodes and the bonding pads. This adhesive layer acts as a mediator that maintains electrical connection while protecting the welding points from direct exposure to water and oxygen, thereby preventing oxidation without compromising bonding strength
Solution Approach 2:
The patent employs a composite structure combining the pyrolytic adhesive layer with the metal bonding pads. The composite material system integrates the electrical conductivity of metal with the protective and adhesive properties of the pyrolytic adhesive, creating a multi-functional interface that simultaneously achieves strong bonding and oxidation resistance
2Reliability
If welding points are exposed to water and oxygen conditions, then electrical connection is maintained, but oxidation occurs leading to increased resistance and power consumption
Solution Approach 1:
The pyrolytic adhesive layer serves as a protective intermediary that allows electrical connection to be maintained through the adhesive while blocking direct contact between water/oxygen and the welding points, thus preventing oxidation without sacrificing electrical conductivity
Solution Approach 2:
The pyrolytic adhesive layer creates a protective environment around the welding points, effectively isolating them from the harmful water and oxygen atmosphere. This inert barrier prevents oxidation by excluding reactive substances from the welding point interface
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents oxidation of welding points, enhancing the reliability and longevity of micro-LED chips and improving the yield and reliability of the display panel by maintaining chip performance and reducing power consumption.
Implementation Method 1
after the pyrolytic adhesive unit is heated, pyrolytic adhesive located between the electrodes of the micro light-emitting chip adheres to the micro light-emitting chip
Implementation Method 2
the pyrolytic adhesive between the electrodes becomes liquid after being heated, and flows to the bonding pads along the electrodes
Data Source
AI summary
A temporary chip assembly, a display panel, and manufacturing methods of the temporary chip assembly and the display panel are provided. In the display panel, welding points between a micro light-emitting chip and corresponding bonding pads on a display backboard are covered with pyrolytic adhesive to block water and oxygen, thereby slowing down or avoiding the oxidation of the welding points.